Etching features using metal passivation

    公开(公告)号:US10361092B1

    公开(公告)日:2019-07-23

    申请号:US15903865

    申请日:2018-02-23

    摘要: A method for etching features in a stack below a patterned mask in an etch chamber is provided. The stack is cooled with a coolant, with a coolant temperature below −20° C. An etch gas comprising a metal containing component, a carbon containing component, and a halogen containing component is flowed into the etch chamber. A plasma is generated from the etch gas. Features are selectively etched in the stack with respect to the patterned mask.

    GAS ADDITIVES FOR SIDEWALL PASSIVATION DURING HIGH ASPECT RATIO CRYOGENIC ETCH

    公开(公告)号:US20180286707A1

    公开(公告)日:2018-10-04

    申请号:US15475021

    申请日:2017-03-30

    摘要: Methods and apparatus for etching a feature in a substrate are provided. The feature may be etched in dielectric material, which may or may not be provided in a stack of materials. The substrate may be etched using cryogenic temperatures and particular classes of reactants. In various examples, the substrate may be etched at a temperature of about −20° C. or lower, using a mixture of reactants that includes at least one reactant that is an iodine-containing fluorocarbon, an iodine-containing fluoride, a bromine-containing fluorocarbon, a sulfur-containing reactant, or one of another select set of reactants. In various embodiments, the combination of low processing temperature with particular reactants results in very effective bow control.