公开(公告)号：US08698186B2

公开(公告)日：2014-04-15

申请号：US13186461

申请日：2011-07-19

Applicant: Lac Nguyen ,  Chang Han

Inventor： Lac Nguyen ,  Chang Han

IPC: H01L33/62

CPC classification number: H05K1/0203 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H05K1/0204 ,  H05K1/0306 ,  H05K1/05 ,  H05K2201/0385 ,  H05K2201/09045 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/10969 ,  H01L2924/00014

Abstract: An LED device with improved circuit board LED support structure is presented. A top surface of a thermally-conductive substrate of this LED device comprises a thermally-conductive pillar. The pillar is not covered with a dielectric layer and an LED package is arranged directly on the pillar with the LED packages bottom thermally-conductive plate in direct contact with the pillar top surface.

Abstract translation: 提出了一种具有改进的电路板LED支撑结构的LED器件。 该LED装置的导热基板的顶面包括导热柱。 柱子不被电介质层覆盖，并且LED封装直接布置在柱上，LED封装底部导热板与柱顶表面直接接触。