发明授权
- 专利标题： Circuit board with thermo-conductive pillar
- 专利标题（中）： 电路板带导热柱
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申请号： US13186461申请日： 2011-07-19
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公开(公告)号： US08698186B2公开(公告)日： 2014-04-15
- 发明人: Lac Nguyen , Chang Han
- 申请人： Lac Nguyen , Chang Han
- 申请人地址： US CA Fremont
- 专利权人： Cofan USA, Inc.
- 当前专利权人： Cofan USA, Inc.
- 当前专利权人地址： US CA Fremont
- 代理机构： Alston & Bird LLP
- 主分类号： H01L33/62
- IPC分类号： H01L33/62
摘要：
An LED device with improved circuit board LED support structure is presented. A top surface of a thermally-conductive substrate of this LED device comprises a thermally-conductive pillar. The pillar is not covered with a dielectric layer and an LED package is arranged directly on the pillar with the LED packages bottom thermally-conductive plate in direct contact with the pillar top surface.
公开/授权文献
- US20130020606A1 CIRCUIT BOARD WITH THERMO-CONDUCTIVE PILLAR 公开/授权日：2013-01-24
信息查询
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