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公开(公告)号：US20180190520A1
公开(公告)日：2018-07-05
申请号：US15795992
申请日：2017-10-27
申请人： LUXNET CORPORATION
发明人： Hsing-Yen LIN , Pi-Cheng LAW , Po-Chao HUANG , Bo-Wei LIU , Ya-Hsin DENG , Hua-Hsin SU
CPC分类号： H01L21/67103 , B32B9/005 , C22C32/0021 , F21V29/89 , H01S5/02272 , H01S5/02469 , H01S5/02476
摘要： The present invention provides a composite heat-dissipating substrate structure, comprising: a heat-dissipating substrate and a heat-conducting metal layer. The heat-dissipating substrate includes a substrate body and a socket formed on the substrate body; and the heat-conducting metal layer widely covers the socket of the substrate body and have one side formed as a loaded side on which a laser semiconductor is to be mounted and a opposite side formed as a heat-dissipating side, so that after the loaded side absorbs heat from the laser semiconductor, the heat-dissipating side reverse to the heat-conducting metal layer diffuses the heat to the heat-dissipating substrate.
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公开(公告)号：US20180019569A1
公开(公告)日：2018-01-18
申请号：US15354261
申请日：2016-11-17
申请人： LuxNet Corporation
发明人： Pi-Cheng LAW , Po-Chao HUANG , Hsing-Yen LIN , Chung-Hsin FU , Hua-Hsin SU
CPC分类号： H01S5/02469 , H01S5/0064 , H01S5/02208 , H01S5/02212 , H01S5/02276 , H01S5/02284 , H01S5/02288 , H01S5/02296 , H01S5/02438 , H01S5/02492
摘要： An optical transmitter with a heat dissipation structure is provided. The heat dissipation structure comprises a substrate and an optical transmitter unit. The substrate comprises a base body, a heat dissipation well disposed on the base body, and a thermal conductive block inserted into and fixed to the heat dissipation well. The thermal conductive block has on one side thereof a heat guiding plane. The optical transmitter unit comprises a heat dissipating substrate directly disposed on the heat guiding plane, and a laser diode directly disposed on the heat dissipating substrate. The laser diode features an active region whose height is lowered to shorten a heat conduction path wherein heat is transferred from the active region through the heat dissipating substrate to the heat guiding plane. The heat already transferred to the heat guiding plane is transferred horizontally by the thermal conductive block to the base body which encloses the heat dissipation well.
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公开(公告)号：US20180248336A1
公开(公告)日：2018-08-30
申请号：US15863662
申请日：2018-01-05
申请人： LUXNET CORPORATION
发明人： Hsing-Yen LIN , Pi-Cheng LAW , Po-Chao HUANG , Bo-Wei LIU , Ya-Hsin DENG , Hua-Hsin SU
CPC分类号： H01S5/02469 , H01S5/02236 , H01S5/02272 , H01S5/02476
摘要： An assembly of semiconductor and highly thermally conductive heat-dissipating substrates includes a thermally conductive metal substrate, a supporting substrate, and a vertical heat-dissipating block. The thermally conductive metal substrate comprises a substrate body, a receiving groove in the substrate body, and a thin-layer portion at a bottom side of the receiving groove. The supporting substrate is provided in the receiving groove. The two vertically opposite sides of the supporting substrate respectively form a carrying surface for carrying a laser diode LD and a heat-dissipating surface in contact with the thin-layer portion at the bottom side of the receiving groove. The vertical heat-dissipating block is provided on a side of the thermally conductive metal substrate opposing to a side with the receiving groove.
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公开(公告)号：US20180188458A1
公开(公告)日：2018-07-05
申请号：US15824285
申请日：2017-11-28
申请人： LUXNET CORPORATION
发明人： Pi-Cheng LAW , Po-Chao HUANG , Po-Sung LIU , Hsing-Yen LIN , Hua-Hsin SU
IPC分类号： G02B6/42
CPC分类号： G02B6/4206 , G02B6/02042 , G02B6/4208 , G02B6/423 , G02B6/4243 , G02B6/4292 , H04B10/25 , H04B10/503
摘要： An optical communication module configured for enhancing optical coupling efficiency, which includes an optical butt joint receptacle and a light emitting body provided on one side of the optical butt joint receptacle. The optical butt joint receptacle has a receptacle body and a through hole provided in the receptacle body for a dual-core optical fiber to extend through. The receptacle body has a light-receiving side and an optical fiber insertion groove corresponding respectively to two ends of the through hole. The light emitting body includes a housing, a laser semiconductor provided in the housing, and an aperture provided in one side of the housing for aligning with the through hole so as that the laser beam emitted by the laser semiconductor is optically coupled to the dual-core optical fiber. The dual-core optical fiber has different core diameters and numerical apertures to enhance the coupling efficiency and reduce the coupling loss in between with the external optical fiber.
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