公开(公告)号：US09682503B2

公开(公告)日：2017-06-20

申请号：US14359911

申请日：2012-11-15

Applicant: LG ELECTRONICS INC.

Inventor： Jinwoo Shim ,  Seokjae Jeong ,  Youngkyu Kim ,  Minkyu Hwang ,  Seokki Hong

IPC: B29C35/00 ,  B29C45/26 ,  B29C33/38 ,  B29C45/37 ,  B29C33/56 ,  B29C45/34 ,  B29C45/73 ,  B29L31/00 ,  B29C33/10

CPC classification number: B29C45/26 ,  B29C33/10 ,  B29C33/38 ,  B29C33/56 ,  B29C45/2608 ,  B29C45/34 ,  B29C45/372 ,  B29C45/73 ,  B29L2031/7622

Abstract: Provided is a mold for molding a decorative outer panel of a refrigerator. A molding part is processed on a surface of the mold formed of a metal or engineering plastic material, but not formed of a glass material, to mold the decorative outer panel of a refrigerator having at least partial three-dimensional shape. Thus, the decorative outer panel having a three-dimensional shape or pattern may be formed through a simple process without performing a post-processing process.

公开(公告)号：US20140335218A1

公开(公告)日：2014-11-13

申请号：US14359911

申请日：2012-11-15

Applicant: LG ELECTRONICS INC

Inventor： Jinwoo Shim ,  Seokjae Jeong ,  Youngkyu Kim ,  Minkyu Hwang ,  Seokki Hong

IPC: B29C45/26 ,  B29C45/34 ,  B29C33/56 ,  B29C45/73

CPC classification number: B29C45/26 ,  B29C33/10 ,  B29C33/38 ,  B29C33/56 ,  B29C45/2608 ,  B29C45/34 ,  B29C45/372 ,  B29C45/73 ,  B29L2031/7622

Abstract: Provided is a mold for molding a decorative outer panel of a refrigerator. A molding part is processed on a surface of the mold formed of a metal or engineering plastic material, but not formed of a glass material, to mold the decorative outer panel of a refrigerator having at least partial three-dimensional shape. Thus, the decorative outer panel having a three-dimensional shape or pattern may be formed through a simple process without performing a post-processing process.

Abstract translation: 提供一种用于模制冰箱的装饰外板的模具。 在由金属或工程塑料材料形成的模具的表面上加工成型部件，但不由玻璃材料形成，以模制具有至少部分三维形状的冰箱的装饰外板。 因此，可以通过简单的工艺形成具有三维形状或图案的装饰外板，而不进行后处理工艺。

公开(公告)号：US11426907B2

公开(公告)日：2022-08-30

申请号：US16073055

申请日：2017-01-19

Applicant: LG Electronics Inc.

Inventor： Joonsang Yang ,  Kyungdo Kim ,  Seokjae Jeong ,  Youngkyu Kim

IPC: B29C45/00 ,  B29C45/27 ,  B29C45/26 ,  B29C45/76 ,  B29K505/00

Abstract: Disclosed is a mold assembly comprising: a cavity forming an inner space to be filled with resin containing metallic particles, and having a protruding part corresponding to a hole of a molded object; a first gate disposed at any one side of the cavity so as to inject the resin into the inner space; and a second gate disposed at another side of the cavity, and injecting the resin, which flows in a second direction intersecting with a first direction, into the inner space so as to change the arrangement of the metallic particles such that a weld line, formed according to the orientation of metallic particle in the first direction, is blurred in an area at which the flow of the resin is separated by the protruding part and then comes back together.