公开(公告)号：US11563836B2

公开(公告)日：2023-01-24

申请号：US17006686

申请日：2020-08-28

Applicant: LG ELECTRONICS INC.

Inventor： Kyungui Park ,  Sunggu Kang ,  Sanggyu Kim

IPC: H04M1/02 ,  H01M10/653 ,  H01M10/6552 ,  H01M10/643 ,  H01M50/213

Abstract: According to an embodiment, an electronic device includes a processor, a frame disposed at a rear side of the processor, a cylindrical battery disposed at a rear side of the frame, a composite sheet having at least one heat insulating member surrounding an outer peripheral surface of the cylindrical battery and at least one thermally conductive member surrounding the heat insulating member, and a heat sink disposed at a rear side of the composite sheet.