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公开(公告)号:US11379022B2
公开(公告)日:2022-07-05
申请号:US16967713
申请日:2018-03-14
Applicant: LG ELECTRONICS INC.
Inventor: Kyungui Park , Byungsun Kim , Wook Kim , Joseph Lee
IPC: G06F1/20 , H05K1/02 , H05K9/00 , H05K7/20 , H04B1/3827
Abstract: The present invention relates to a mobile terminal comprising: a terminal body; a circuit board mounted inside the terminal body; an electronic device mounted on one surface of the circuit board; a shield can provided on the circuit board so as to surround the electronic device and shielding electromagnetic waves generated from the electronic device; a metal plate coupled to the shield can and made of a material having high thermal conductivity; and a heat pipe which is positioned to face the shield can with the metal plate interposed therebetween and has a flow path to accommodate a fluid at a center portion thereof, wherein the metal plate and the heat pipe are integrally formed, and heat generated in the electronic device can be transmitted to the heat pipe through the metal plate.
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公开(公告)号:US09986072B2
公开(公告)日:2018-05-29
申请号:US15545599
申请日:2015-03-23
Applicant: LG ELECTRONICS INC.
Inventor: Joseph Lee , Donghyun Kim , Kyungui Park
CPC classification number: H04M1/0202 , H05K5/04 , H05K7/20 , H05K7/20454 , H05K7/20472 , H05K7/20481 , H05K9/0024
Abstract: There is disclosed a mobile terminal including a case comprising an electric control unit in which electronic components are loaded; a display unit coupled to a front surface of the case; a frame coupled to the case and supporting a rear surface of the display unit, the frame comprising a metallic material; a mainboard loaded in the case; a drive chip loaded in the mainboard; a shield can covering components loaded in the mainboard, the shied comprising a hole formed, corresponding to the drive chip; a thermal conductivity sheet comprising one surface in contact with a top surface of the drive chip and the other surface in contact with an inner surface of the frame; and a flexible material insertedly filling in a space formed between the thermal conductivity sheet and the frame, so that the heat generated in the drive chip of the mobile terminal may be effectively emitted and that only the portion of the mobile terminal, where the drive chip is loaded, may be prevented from being heated when the user is using the mobile terminal and the other components may be prevented from being damaged by the heat.
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公开(公告)号:US11563836B2
公开(公告)日:2023-01-24
申请号:US17006686
申请日:2020-08-28
Applicant: LG ELECTRONICS INC.
Inventor: Kyungui Park , Sunggu Kang , Sanggyu Kim
IPC: H04M1/02 , H01M10/653 , H01M10/6552 , H01M10/643 , H01M50/213
Abstract: According to an embodiment, an electronic device includes a processor, a frame disposed at a rear side of the processor, a cylindrical battery disposed at a rear side of the frame, a composite sheet having at least one heat insulating member surrounding an outer peripheral surface of the cylindrical battery and at least one thermally conductive member surrounding the heat insulating member, and a heat sink disposed at a rear side of the composite sheet.
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公开(公告)号:US09826073B2
公开(公告)日:2017-11-21
申请号:US14643784
申请日:2015-03-10
Applicant: LG ELECTRONICS INC.
Inventor: Kyungui Park , Donghyun Kim , Joseph Lee , Wonkee Ahn , Donghyun Kim , Changwoo Song
CPC classification number: H04M1/0202 , G04G21/00 , H05K7/20336 , H05K7/2039
Abstract: A watch type mobile terminal includes a main body configured to include an electric apparatus unit in which an electronic part is mounted, a band configured to be worn on a wrist of a user in a manner of being combined with the main body, a heat pipe configured to include a first pipe positioned at the main body and a second pipe positioned at the band wherein the first pipe and the second pipe forms a loop in a manner of being connected with each other, a first working fluid injected into the heat pipe and a second working fluid different from the first working fluid in density. The watch type mobile terminal can emit heat of the main body at the band using the heat pipe.
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公开(公告)号:US09743553B2
公开(公告)日:2017-08-22
申请号:US14559616
申请日:2014-12-03
Applicant: LG ELECTRONICS INC.
Inventor: Byungsoo Kim , Joseph Lee , Kyungui Park , Wonkee Ahn , Donghyun Kim
CPC classification number: H05K7/20336 , H04M1/026
Abstract: A mobile terminal having a structure increasing heat dissipation efficiency, including a printed circuit board (PCB) disposed within a terminal body and having a heating element which generates heat mounted thereon, a frame having a space formed on one surface thereof and allowing the PCB to be installed therein, and a heat pipe supported by the frame, disposed on one surface of the frame, and connected to the PCB to dissipate heat generated by the heating element outwardly from the terminal body, wherein the frame includes a hold portion extending from an end portion thereof to cover at least a portion of the heat pipe in order to prevent the heat pipe from being released from the frame by external force applied to the terminal body.
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