公开(公告)号：US20250155207A1

公开(公告)日：2025-05-15

申请号：US18835857

申请日：2023-02-03

Applicant: LG ELECTRONICS INC.

Inventor： Subeen SHIN ,  Younghwan KO ,  Hae Seung LEE ,  Yeongpin CHU

IPC: F28F13/18 ,  F28F19/04

Abstract: The present disclosure relates to a complex coating film, and a fin and tube type heat exchanger and a microchannel type heat exchanger comprising the same. The complex coating film in the present disclosure comprises a metallic material; a first coating layer being formed on the metallic material; and a second coating layer being formed on the first coating layer, wherein the first coating layer comprises 10-40 wt % of a first hydrophilic resin, 1-20 wt % of a metal compound, 5-20 wt % of an amide-based cross linker, 1-15 wt % of a silane compound and water as a remaining component, and the second coating layer comprises 1-20 wt % of a second hydrophilic resin, 1-20 wt % of a silica particle, 0.01-5 wt % of a cross linker, 0.1-5 wt % of a solvent, and water as a remaining component, providing long-lasting corrosion resistance and hydrophilicity to the complex coating film.