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    System setting adjustment based on location
    1.
    发明授权
    System setting adjustment based on location 有权

    公开(公告)号：US12093211B2

    公开(公告)日：2024-09-17

    申请号：US17557416

    申请日：2021-12-21

    Applicant: Lenovo (Singapore) Pte. Ltd.

    Inventor： Kenneth Seethaler ,  Philip J Jakes ,  Adam Cavenaugh ,  Tin-Lup Wong ,  Koji Kawakita ,  David Douglas ,  Kazuo Fujii

    IPC: G06F15/78

    CPC classification number: G06F15/7882

    Abstract: One embodiment provides a method, including: identifying, based on context data, a location of an information handling device; accessing a settings profile for the information handling device that is based on the identified location; determining, using a processor, whether at least one current setting on the information handling device is inconsistent with the settings profile; and adjusting, responsive to determining that the at least one current setting is inconsistent with the settings profile, the at least one current setting to match the settings profile for the location. Other aspects are described and claimed.

    THERMALLY CONDUCTIVE COMPOSITIONS FOR TARGETED HEAT DISSIPATION OF ELECTRONIC COMPONENTS
    5.
    发明申请
    THERMALLY CONDUCTIVE COMPOSITIONS FOR TARGETED HEAT DISSIPATION OF ELECTRONIC COMPONENTS 有权

    公开(公告)号：US20230057644A1

    公开(公告)日：2023-02-23

    申请号：US17404766

    申请日：2021-08-17

    Applicant: Lenovo (Singapore) PTE. LTD.

    Inventor： Bouziane Yebka ,  Tin-Lup Wong ,  Philip J. Jakes

    IPC: H05K7/20

    Abstract: Thermal spreaders for targeted heat dissipation of an electronic component are disclosed. One thermal spreader includes a thermally conductive composition configured to function in conjunction with an electrically insulator material to dissipate heat away from a heat-generating electronic component of a computing device while electrically insulating the electronic component. The thermally conductive composition is malleable to target placement of the thermally conductive material on the electrically insulator material such that the thermally conductive composition is in thermal communication with a targeted area of the electronic component over which the electrically insulator material is positioned for targeted heat dissipation of the electronic component. Apparatus and systems including one or more of the thermal spreaders for targeted heat dissipation of one or more electronic components included therein are also disclosed.

    SCREW RELEASE
    6.
    发明申请
    SCREW RELEASE 有权

    公开(公告)号：US20220154748A1

    公开(公告)日：2022-05-19

    申请号：US16951755

    申请日：2020-11-18

    Applicant: LENOVO (Singapore) PTE. LTD.

    Inventor： Bouziane Yebka ,  Tin-Lup Wong ,  Philip Jakes

    IPC: F16B5/02 ,  F16B31/02

    Abstract: For screw release, an apparatus includes a boss, a screw secured to the boss, and a force release component connected to one of the boss and the screw. The force release component releases a portion of the screw from the boss in response to a specified force.

    SYSTEM HINGE ASSEMBLY
    7.
    发明申请
    SYSTEM HINGE ASSEMBLY 有权

    公开(公告)号：US20220035418A1

    公开(公告)日：2022-02-03

    申请号：US16945433

    申请日：2020-07-31

    Applicant: Lenovo (Singapore) Pte. Ltd.

    Inventor： Joseph Anthony Holung ,  Bouziane Yebka ,  Philip John Jakes ,  Tin-Lup Wong ,  Joseph David Plunkett

    IPC: G06F1/16 ,  E05D3/02

    Abstract: A system can include a housing that defines a first plane; a base that defines a second plane; and an adjustable hinge assembly that rotatably couples the base and the housing about an axis, where the hinge assembly includes permanent magnets that generate a first magnetic field and a second magnetic field orientable with respect to each other via rotation of the housing with respect to the base, where the first magnetic field and the second magnetic field include an aligned orientation, generate a clockwise restoring torque responsive to rotation of the housing in a first rotational direction from the aligned orientation, and generate a counterclockwise restoring torque responsive to rotation of the housing in a second, opposite rotational direction from the aligned orientation, and where the aligned orientation is adjustable to correspond to a selected angle between the first plane and the second plane.

    SHAPE-MEMORY HEAT ABSORBERS
    9.
    发明申请
    SHAPE-MEMORY HEAT ABSORBERS 有权

    公开(公告)号：US20220018606A1

    公开(公告)日：2022-01-20

    申请号：US16930317

    申请日：2020-07-16

    Applicant: Lenovo (Singapore) Pte. Ltd.

    Inventor： Bouziane Yebka ,  Joseph Anthony Holung ,  Tin-Lup Wong ,  Philip John Jakes

    IPC: F28D15/02 ,  F28F27/02

    Abstract: In one aspect, a device may include a housing, at least one processor within the housing, storage accessible to the at least one processor and within the housing, and plural heat absorbers within the housing that may be spherical. Each heat absorber may include an outer shell and inner material. The outer shell may include a shape-memory material. The inner material may include phase-change material different from the shape-memory material. The melting point of the phase-change material may be lower than the melting point of the shape-memory material. The heat absorbers may be juxtaposed with one or more other components of the device to absorb heat from the one or more other components.

    System hinge assembly
    10.
    发明授权
    System hinge assembly 有权

    公开(公告)号：US11216043B1

    公开(公告)日：2022-01-04

    申请号：US16945414

    申请日：2020-07-31

    Applicant: Lenovo (Singapore) Pte. Ltd.

    Inventor： Joseph Anthony Holung ,  Bouziane Yebka ,  Philip John Jakes ,  Tin-Lup Wong ,  Joseph David Plunkett

    IPC: G06F1/16 ,  E05D7/00 ,  E05D11/00 ,  H02S10/40 ,  H02K37/18

    Abstract: A system can include a housing; a hinge assembly operatively coupled to the housing for rotation of the housing about a hinge axis, where the hinge assembly includes permanent magnets that generate a first magnetic field and a second magnetic field orientable with respect to each other via rotation of the housing, where the first magnetic field and the second magnetic field include an aligned orientation, generate a clockwise restoring torque responsive to rotation of the housing in a first rotational direction from the aligned orientation, and generate a counterclockwise restoring torque responsive to rotation of the housing in a second, opposite rotational direction from the aligned orientation; and an electromagnetic mover operatively coupled to the housing for rotation of the housing about the hinge axis.

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