公开(公告)号：US20180282503A1

公开(公告)日：2018-10-04

申请号：US15531613

申请日：2015-12-08

Applicant: Kureha Corporation

Inventor： Yasuhiro SUZUKI ,  Naoko KURIU ,  Shintaro NOMURA ,  Tetsuo EJIRI ,  Shunzo ENDO

IPC: C08J9/20 ,  C08F220/48 ,  C08J9/14 ,  B01J13/14

CPC classification number: C08J9/20 ,  B01J13/14 ,  B01J13/185 ,  C08F2/44 ,  C08F220/44 ,  C08F220/48 ,  C08J9/141 ,  C08J2201/026 ,  C08J2203/14 ,  C08J2203/182 ,  C08J2203/202 ,  C08J2433/20 ,  C08L101/00 ,  C09K3/00

Abstract: Object:To provide thermally expandable microspheres having little sag.Resolution Means:The thermally expandable microspheres have a structure in which a foaming agent is encapsulated in an outer shell formed from a polymer, wherein, the ratio (%) of (R2/R1)×100 is at least 105%, where R1 is the expansion ratio after the thermally expandable microspheres have been heat-treated for 5 minutes at 150° C. and then foamed by heating for 2 minutes at 200° C., and R2 is the expansion ratio after the thermally expandable microspheres have been heat-treated for 5 minutes at 150° C. and then foamed by heating for 4 minutes at 200° C.