METHOD FOR MANUFACTURING FLEXIBLE LAMINATED PIEZOELECTRIC COMPOSITE

    公开(公告)号:US20230081954A1

    公开(公告)日:2023-03-16

    申请号:US17897502

    申请日:2022-08-29

    Abstract: Disclosed is a method for manufacturing a laminated piezoelectric composite. The method includes wet-mixing ceramic powder, a polymer binder, a plasticizer and a solvent for 4 to 72 hours so as to generate a mixed slurry, introducing the mixed slurry into a tape casting process so as to prepare a plurality of piezoelectric composite sheets, drying and forming the plurality of piezoelectric composite sheets using a roll-to-roll process so as to prepare the plurality of formed piezoelectric composite sheets, forming internal electrodes on the plurality of piezoelectric composite sheets so as to prepare the plurality of piezoelectric composite sheets having the internal electrodes, laminating and pressing the plurality of piezoelectric composite sheets having the internal electrodes so as to generate a piezoelectric composite sheet laminate having the internal electrodes, and cutting the piezoelectric composite sheet laminate having the internal electrodes into a desired shape and size.

    LOW-DIELECTRIC THERMALLY CURABLE RESIN COMPOSITION AND LOW DIELECTRIC MATERIAL PREPARED THEREFROM

    公开(公告)号:US20220169769A1

    公开(公告)日:2022-06-02

    申请号:US17541023

    申请日:2021-12-02

    Abstract: This application relates to a low-dielectric thermally curable resin composition for solving a problem of increased transmission loss. In one aspect, the low-dielectric thermally curable resin composition includes a (meth)acrylic monomer having an alicyclic heterocycle, a polyfunctional (meth)acrylic monomer, an initiator, and a curing accelerator, and a low dielectric material prepared therefrom. Various embodiments can provide excellent low dielectric properties with a dielectric constant (Dk) in a high frequency area of 1 to 20 GHz of less than, for example, 3.28. In addition, the low dielectric material can have a significantly reduced transmission loss with a dissipation factor (Df) in an area of 1 to 20 GHz of less than, for example, 0.008, and thus, may implement excellent transmission properties in excellent 5G mobile communication.

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