公开(公告)号：US20160037637A1

公开(公告)日：2016-02-04

申请号：US14449089

申请日：2014-07-31

Applicant: Keysight Technologies, Inc.

Inventor： Brian Wade Carlson ,  William Hollender ,  Donald Ingram

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K1/0269 ,  H05K3/4638 ,  H05K2201/041 ,  H05K2201/0919 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/09936 ,  H05K2203/166

Abstract: A printed circuit board (PCB) includes a stack of core layers disposed one over another, and electrically conductive interconnects extending vertically in the stack. Each of the core layers includes a substrate having opposite major surfaces, an electrically conductive active trace extending along at least one of the major surfaces, and an indicium. The stack also has an exposed edge where the indicia of the layers are together revealed. The indicia provide identifying and/or fiducial information about the PCB.

Abstract translation: 印刷电路板（PCB）包括一层叠置的芯层，以及在堆叠中垂直延伸的导电互连。 每个芯层包括具有相反主要表面的基底，沿主要表面中的至少一个延伸的导电活性迹线和标记。 堆叠还具有暴露的边缘，其中层的标记一起显露。 标记提供关于PCB的识别和/或基准信息。

公开(公告)号：US09572257B2

公开(公告)日：2017-02-14

申请号：US14449089

申请日：2014-07-31

Applicant: Keysight Technologies, Inc.

Inventor： Brian Wade Carlson ,  William Hollender ,  Donald Ingram

IPC: H05K1/09 ,  H05K1/11

CPC classification number: H05K1/115 ,  H05K1/0269 ,  H05K3/4638 ,  H05K2201/041 ,  H05K2201/0919 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/09936 ,  H05K2203/166

Abstract: A printed circuit board (PCB) includes a stack of core layers disposed one over another, and electrically conductive interconnects extending vertically in the stack. Each of the core layers includes a substrate having opposite major surfaces, an electrically conductive active trace extending along at least one of the major surfaces, and an indicium. The stack also has an exposed edge where the indicia of the layers are together revealed. The indicia provide identifying and/or fiducial information about the PCB.

Abstract translation: 印刷电路板（PCB）包括一层叠置的芯层，以及在堆叠中垂直延伸的导电互连。 每个芯层包括具有相反主要表面的基底，沿主要表面中的至少一个延伸的导电活性迹线和标记。 堆叠还具有暴露的边缘，其中层的标记一起显露。 标记提供关于PCB的识别和/或基准信息。