HIGH DATA RATE CONNECTOR SYSTEM
    4.
    发明申请
    HIGH DATA RATE CONNECTOR SYSTEM 审中-公开
    高数据速率连接器系统

    公开(公告)号:US20120003848A1

    公开(公告)日:2012-01-05

    申请号:US13130519

    申请日:2010-03-24

    IPC分类号: H01R12/73 H05K1/11

    摘要: A connector and circuit board assembly includes terminals in a connector that are mounted to vias in a circuit board. Signal and ground terminals are thus coupled to signal traces and ground planes in the circuit board. Additional pinning vias that are aligned with the ground vias may be provided in a circuit board to help improve electrical performance at the interface between the terminals in the connector and the signal traces in the circuit board. A signal collar may allow pairs of signal traces to be split and routed around two difference sides of a via before rejoining while maintaining close electrical proximity that provides for relatively consistent electrical coupling between the traces in the pair of signal traces.

    摘要翻译: 连接器和电路板组件包括安装到电路板中的通孔的连接器中的端子。 因此,信号和接地端子耦合到电路板中的信号迹线和接地层。 可以在电路板中提供与接地通孔对准的附加的钉扎通孔,以帮助改善连接器中的端子与电路板中的信号迹线之间的接口处的电气性能。 信号环可以允许成对的信号迹线在重新接合之前绕通孔的两个不同侧被分开和布线,同时保持紧密的电接近,其提供一对信号迹线中的迹线之间的相对一致的电耦合。

    GROUND TERMINATION WITH DAMPENED RESONANCE
    6.
    发明申请
    GROUND TERMINATION WITH DAMPENED RESONANCE 有权
    具有阻尼共振的接地终止

    公开(公告)号:US20110100694A1

    公开(公告)日:2011-05-05

    申请号:US12918898

    申请日:2009-07-22

    IPC分类号: H01R13/646

    摘要: A system of dampening resonance is provided. In an embodiment, ground traces may be coupled to a common or ground plane via dampening elements such as resistors a predetermined distance from a non-dampened coupling. Ground terminals in a connector have with a separated electrical length that allows for a potential to exist between the ground terminal and a common ground. When the ground terminals are coupled to the ground traces, the dampening element, which may be a resistor, helps convert energy traveling over ground terminal into heat, thus reducing or preventing resonance conditions in the connector.

    摘要翻译: 提供了一种阻尼共振系统。 在一个实施例中,接地迹线可以经由诸如电阻器之类的阻尼元件与非阻尼耦合器预定距离的公共或接地平面耦合。 连接器中的接地端子具有分离的电气长度,允许在接地端子和公共地面之间存在电位。 当接地端子耦合到接地迹线时,阻尼元件(其可以是电阻器)有助于将接地端子上传播的能量转换成热量,从而减少或防止连接器中的共振条件。

    Connector with terminals forming differential pairs
    8.
    发明授权
    Connector with terminals forming differential pairs 有权
    带端子的连接器形成差分对

    公开(公告)号:US08545240B2

    公开(公告)日:2013-10-01

    申请号:US13129264

    申请日:2009-11-13

    IPC分类号: H01R4/66

    摘要: A connector assembly is provided that is suitable for controlling the resonance frequency of ground terminals used to shield high-speed differential pairs. Ground terminals may be commonized so as to provide ground terminals with a predetermined maximum electrical length. Reducing the electrical length of the ground terminal can move a resonance frequency of the ground terminals of the connector outside the range of frequencies at which signals will transmitted.

    摘要翻译: 提供适于控制用于屏蔽高速差分对的接地端子的谐振频率的连接器组件。 接地端子可以被公共以便为接地端子提供预定的最大电气长度。 降低接地端子的电气长度可以将连接器的接地端子的谐振频率移动到信号传播的频率范围之外。

    Connector with improved manufacturability
    10.
    发明授权
    Connector with improved manufacturability 有权
    连接器具有改进的可制造性

    公开(公告)号:US08226441B2

    公开(公告)日:2012-07-24

    申请号:US13063008

    申请日:2009-09-09

    IPC分类号: H01R24/00

    摘要: An I/O connector has a housing that contains a plurality of individual terminal wafers containing terminal dedicated to either ground signals or differential signals. The terminals are arranged in widthwise order to define broadside coupled differential signal terminal pairs. The ground terminals are wider than the signal terminals to provide shielding to the differential signal pairs. The body portions of the ground terminals include pairs of opposed notches that provide for increased retention of the ground terminals in the wafer and provide increased flow for molding material during the formation of the wafers.

    摘要翻译: I / O连接器具有包含多个单独的端子晶片的壳体,其包含专用于接地信号或差动信号的端子。 端子以宽度方式布置以限定宽边耦合的差分信号端子对。 接地端子比信号端子宽,为差分信号对提供屏蔽。 接地端子的主体部分包括成对的相对的凹口,其提供了接地端子在晶片中的增加的保持性并且在晶片形成期间为模制材料提供增加的流动。