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公开(公告)号:US20070283529A1
公开(公告)日:2007-12-13
申请号:US11450906
申请日:2006-06-08
申请人: Kenichi Hashizume , Harri Lasarov , Markku Heino
发明人: Kenichi Hashizume , Harri Lasarov , Markku Heino
IPC分类号: E05D1/00
CPC分类号: E05D1/02 , E05D9/00 , E05Y2800/205 , E05Y2900/606 , Y10T16/525
摘要: A living hinge structure has two plastic side sections and a plastic connecting section, wherein the plastic side sections are integrated with metal supports so as to enhance the strength of the living hinge structure. The metal supports can be metal inserts bonded to the plastic side sections in an over-molding process. Each of the metal supports can be located on the outside surface or the inside surface of the plastic section. When the metal sections are located on the outside surfaces, they can be used to restrict the opening angle of the hinge. The metal supports can also be a part of a device that uses the hinge for mechanically coupling two device parts. As such, the living hinge is directly integrated into the device without the need for post-assembling by using screws, adhesive, welding or heat stacking.
摘要翻译: 活动铰链结构具有两个塑料侧部和塑料连接部,其中,塑料侧部与金属支撑体一体化,以提高活动铰链结构的强度。 金属支撑件可以是在过度模制过程中结合到塑料侧部的金属插入件。 每个金属支撑件可以位于塑料部分的外表面或内表面上。 当金属部分位于外表面上时,它们可用于限制铰链的开启角度。 金属支撑件也可以是使用铰链来机械地耦合两个装置部件的装置的一部分。 因此,活动铰链直接集成到装置中,而不需要通过使用螺钉,粘合剂,焊接或热堆叠来进行后组装。
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公开(公告)号:US20090002242A1
公开(公告)日:2009-01-01
申请号:US11823198
申请日:2007-06-26
申请人: Harri Lasarov , Jussi Hakunti , Pekka Kilpi , Markku Heino , Andrew Strawn , Simon James Quainton , Petra Ollitervo , James Eldon , David Kevin Etherton
发明人: Harri Lasarov , Jussi Hakunti , Pekka Kilpi , Markku Heino , Andrew Strawn , Simon James Quainton , Petra Ollitervo , James Eldon , David Kevin Etherton
摘要: A housing for a portable electronic device including a housing portion; and an antenna element embedded within the housing portion, and operable at a resonant frequency, wherein the antenna element includes at least one folded portion and has a thickness substantially equal to at least four skin depths at the resonant frequency.
摘要翻译: 一种用于便携式电子设备的壳体,包括壳体部分; 以及天线元件,其嵌入在所述壳体部分内并且以共振频率操作,其中所述天线元件包括至少一个折叠部分,并且具有基本上等于所述共振频率处的至少四个趋肤深度的厚度。
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公开(公告)号:US07486517B2
公开(公告)日:2009-02-03
申请号:US11642571
申请日:2006-12-20
申请人: Teppo Aapro , Harri Lasarov
发明人: Teppo Aapro , Harri Lasarov
CPC分类号: H05K7/20436 , H04M1/026 , H04M1/0277
摘要: A hand-held portable electronic device frame assembly including a heat spreader made from a thermally conductive material; and an overmolded frame member which has been overmolded onto the heat spreader. The overmolded frame member includes a molded polymer material which forms a thermal insulator on the heat spreader. The frame member is adapted to structurally support at least one component of a hand-held portable electronic device thereon.
摘要翻译: 一种手提便携式电子设备框架组件,包括由导热材料制成的散热器; 以及已经包覆模制到散热器上的包覆模制的框架构件。 包覆成型的框架构件包括在散热器上形成绝热体的模制聚合物材料。 框架构件适于在其上结构地支撑手持便携式电子装置的至少一个部件。
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公开(公告)号:US20080151503A1
公开(公告)日:2008-06-26
申请号:US11642571
申请日:2006-12-20
申请人: Teppo Aapro , Harri Lasarov
发明人: Teppo Aapro , Harri Lasarov
IPC分类号: H05K7/20
CPC分类号: H05K7/20436 , H04M1/026 , H04M1/0277
摘要: A hand-held portable electronic device frame assembly including a heat spreader made from a thermally conductive material; and an overmolded frame member which has been overmolded onto the heat spreader. The overmolded frame member includes a molded polymer material which forms a thermal insulator on the heat spreader. The frame member is adapted to structurally support at least one component of a hand-held portable electronic device thereon.
摘要翻译: 一种手提便携式电子设备框架组件,包括由导热材料制成的散热器; 以及已经包覆模制到散热器上的包覆模制的框架构件。 包覆成型的框架构件包括在散热器上形成绝热体的模制聚合物材料。 框架构件适于在其上结构地支撑手持便携式电子装置的至少一个部件。
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公开(公告)号:US07742309B2
公开(公告)日:2010-06-22
申请号:US11647613
申请日:2006-12-29
申请人: Jussi Hakunti , Pekka Kilpi , Anssi Vänskä , Teppo Aapro , Harri Lasarov
发明人: Jussi Hakunti , Pekka Kilpi , Anssi Vänskä , Teppo Aapro , Harri Lasarov
IPC分类号: H05K5/00
CPC分类号: H05K5/065 , H05K3/284 , H05K5/062 , H05K2201/0209 , H05K2201/10371 , H05K2203/1316 , H05K2203/1322
摘要: An electronic device and method of assembling an electronic device, said device including an electronic component; an electrically insulating protective layer overlaying and in contact with at least a portion of the electronic component; and injection molded material overlaying at least the portion of the component and the overlaying protective layer.
摘要翻译: 一种组装电子设备的电子设备和方法,所述设备包括电子部件; 覆盖并与所述电子部件的至少一部分接触的电绝缘保护层; 和至少覆盖部件和覆盖保护层的部分的注射成型材料。
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公开(公告)号:US20080070001A1
公开(公告)日:2008-03-20
申请号:US11523140
申请日:2006-09-19
申请人: Harri Lasarov , Pekka Kilpi
发明人: Harri Lasarov , Pekka Kilpi
IPC分类号: G11B5/64
CPC分类号: B29C45/14311 , B29C45/1418 , B29C45/561 , B29C2045/14237 , B29C2045/14868 , Y10T428/24355
摘要: The present invention relates generally to plastic-acceptor hybrid components and, more particularly, to the direct bonding of over-moulded plastics to an acceptor insert, such as a metal, in an injection moulding tool. A method and apparatus are provided allowing the production of the present plastic-acceptor hybrid components in which the bonding of said components is obtained by anchoring the plastic component in micro-holes formed in the surface of an acceptor component.
摘要翻译: 本发明一般涉及塑料 - 受体混合部件,更具体地说,涉及在注模工具中将过模制塑料直接粘合到受体插入物(例如金属)上。 提供了一种方法和装置,其允许生产本发明的塑料 - 受体混合组分,其中所述组分的结合是通过将塑料组分锚定在形成于受体组分表面的微孔中获得的。
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公开(公告)号:US20100284552A1
公开(公告)日:2010-11-11
申请号:US12520039
申请日:2006-12-21
申请人: Harri Lasarov , Titta Wiberg
发明人: Harri Lasarov , Titta Wiberg
CPC分类号: H04M1/18 , B29C45/14549 , B29C45/14639 , H04M1/05 , H04R1/02 , H05K5/062 , H05K5/065
摘要: An electronic device comprises electronic circuitry and a moulded plastic covering (5). In order to prevent ingress of water and dust, a hermetic seal is provided between the covering (5) and components that are accessible through the covering (5), such as a socket (7) or display, or components such as electrical connections (9). The components (7, 9) are at least partially coated in a coating material 15, such as a thermally activated polyurethane adhesive or thin thermoplastic, to provide a strong bond to the covering (5) that does not require the use of solder. The device may be a wearable device in which waterproof sealing is required.
摘要翻译: 电子设备包括电子电路和模制塑料覆盖物(5)。 为了防止水和灰尘的进入,在覆盖物(5)和可通过覆盖物(5)可接近的部件(例如插座(7)或显示器)或诸如电连接的部件( 9)。 部件(7,9)至少部分地涂覆在诸如热活化聚氨酯粘合剂或薄热塑性材料的涂层材料15中,以提供与不需要使用焊料的覆盖物(5)的强结合。 该装置可以是需要防水密封的可穿戴装置。
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公开(公告)号:US20080158825A1
公开(公告)日:2008-07-03
申请号:US11647613
申请日:2006-12-29
申请人: Jussi Hakunti , Pekka Kilpi , Anssi Vanska , Teppo Aapro , Harri Lasarov
发明人: Jussi Hakunti , Pekka Kilpi , Anssi Vanska , Teppo Aapro , Harri Lasarov
IPC分类号: H05K7/20
CPC分类号: H05K5/065 , H05K3/284 , H05K5/062 , H05K2201/0209 , H05K2201/10371 , H05K2203/1316 , H05K2203/1322
摘要: An electronic device and method of assembling an electronic device, said device including an electronic component; an electrically insulating protective layer overlaying and in contact with at least a portion of the electronic component; and injection molded material overlaying at least the portion of the component and the overlaying protective layer.
摘要翻译: 一种组装电子设备的电子设备和方法,所述设备包括电子部件; 覆盖并与所述电子部件的至少一部分接触的电绝缘保护层; 和至少覆盖部件和覆盖保护层的部分的注射成型材料。
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