Plastic living hinge with metal support
    1.
    发明申请
    Plastic living hinge with metal support 审中-公开
    塑料活动铰链与金属支撑

    公开(公告)号:US20070283529A1

    公开(公告)日:2007-12-13

    申请号:US11450906

    申请日:2006-06-08

    IPC分类号: E05D1/00

    摘要: A living hinge structure has two plastic side sections and a plastic connecting section, wherein the plastic side sections are integrated with metal supports so as to enhance the strength of the living hinge structure. The metal supports can be metal inserts bonded to the plastic side sections in an over-molding process. Each of the metal supports can be located on the outside surface or the inside surface of the plastic section. When the metal sections are located on the outside surfaces, they can be used to restrict the opening angle of the hinge. The metal supports can also be a part of a device that uses the hinge for mechanically coupling two device parts. As such, the living hinge is directly integrated into the device without the need for post-assembling by using screws, adhesive, welding or heat stacking.

    摘要翻译: 活动铰链结构具有两个塑料侧部和塑料连接部,其中,塑料侧部与金属支撑体一体化,以提高活动铰链结构的强度。 金属支撑件可以是在过度模制过程中结合到塑料侧部的金属插入件。 每个金属支撑件可以位于塑料部分的外表面或内表面上。 当金属部分位于外表面上时,它们可用于限制铰链的开启角度。 金属支撑件也可以是使用铰链来机械地耦合两个装置部件的装置的一部分。 因此,活动铰链直接集成到装置中,而不需要通过使用螺钉,粘合剂,焊接或热堆叠来进行后组装。

    Hand-held portable electronic device having a heat spreader
    3.
    发明授权
    Hand-held portable electronic device having a heat spreader 有权
    具有散热器的手持便携式电子设备

    公开(公告)号:US07486517B2

    公开(公告)日:2009-02-03

    申请号:US11642571

    申请日:2006-12-20

    IPC分类号: H05K7/20 H01L23/36

    摘要: A hand-held portable electronic device frame assembly including a heat spreader made from a thermally conductive material; and an overmolded frame member which has been overmolded onto the heat spreader. The overmolded frame member includes a molded polymer material which forms a thermal insulator on the heat spreader. The frame member is adapted to structurally support at least one component of a hand-held portable electronic device thereon.

    摘要翻译: 一种手提便携式电子设备框架组件,包括由导热材料制成的散热器; 以及已经包覆模制到散热器上的包覆模制的框架构件。 包覆成型的框架构件包括在散热器上形成绝热体的模制聚合物材料。 框架构件适于在其上结构地支撑手持便携式电子装置的至少一个部件。

    Hand-held portable electronic device having a heat spreader
    4.
    发明申请
    Hand-held portable electronic device having a heat spreader 有权
    具有散热器的手持便携式电子设备

    公开(公告)号:US20080151503A1

    公开(公告)日:2008-06-26

    申请号:US11642571

    申请日:2006-12-20

    IPC分类号: H05K7/20

    摘要: A hand-held portable electronic device frame assembly including a heat spreader made from a thermally conductive material; and an overmolded frame member which has been overmolded onto the heat spreader. The overmolded frame member includes a molded polymer material which forms a thermal insulator on the heat spreader. The frame member is adapted to structurally support at least one component of a hand-held portable electronic device thereon.

    摘要翻译: 一种手提便携式电子设备框架组件,包括由导热材料制成的散热器; 以及已经包覆模制到散热器上的包覆模制的框架构件。 包覆成型的框架构件包括在散热器上形成绝热体的模制聚合物材料。 框架构件适于在其上结构地支撑手持便携式电子装置的至少一个部件。

    Plastic-acceptor hybrid components
    6.
    发明申请
    Plastic-acceptor hybrid components 审中-公开
    塑料受体混合组分

    公开(公告)号:US20080070001A1

    公开(公告)日:2008-03-20

    申请号:US11523140

    申请日:2006-09-19

    IPC分类号: G11B5/64

    摘要: The present invention relates generally to plastic-acceptor hybrid components and, more particularly, to the direct bonding of over-moulded plastics to an acceptor insert, such as a metal, in an injection moulding tool. A method and apparatus are provided allowing the production of the present plastic-acceptor hybrid components in which the bonding of said components is obtained by anchoring the plastic component in micro-holes formed in the surface of an acceptor component.

    摘要翻译: 本发明一般涉及塑料 - 受体混合部件,更具体地说,涉及在注模工具中将过模制塑料直接粘合到受体插入物(例如金属)上。 提供了一种方法和装置,其允许生产本发明的塑料 - 受体混合组分,其中所述组分的结合是通过将塑料组分锚定在形成于受体组分表面的微孔中获得的。

    Mounting Components In Electronic Devices
    7.
    发明申请
    Mounting Components In Electronic Devices 有权
    电子设备中的安装元件

    公开(公告)号:US20100284552A1

    公开(公告)日:2010-11-11

    申请号:US12520039

    申请日:2006-12-21

    IPC分类号: H04R25/00 H05K7/00 B32B37/24

    摘要: An electronic device comprises electronic circuitry and a moulded plastic covering (5). In order to prevent ingress of water and dust, a hermetic seal is provided between the covering (5) and components that are accessible through the covering (5), such as a socket (7) or display, or components such as electrical connections (9). The components (7, 9) are at least partially coated in a coating material 15, such as a thermally activated polyurethane adhesive or thin thermoplastic, to provide a strong bond to the covering (5) that does not require the use of solder. The device may be a wearable device in which waterproof sealing is required.

    摘要翻译: 电子设备包括电子电路和模制塑料覆盖物(5)。 为了防止水和灰尘的进入,在覆盖物(5)和可通过覆盖物(5)可接近的部件(例如插座(7)或显示器)或诸如电连接的部件( 9)。 部件(7,9)至少部分地涂覆在诸如热活化聚氨酯粘合剂或薄热塑性材料的涂层材料15中,以提供与不需要使用焊料的覆盖物(5)的强结合。 该装置可以是需要防水密封的可穿戴装置。