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    Method for manufacturing semiconductor apparatus and mold assembly for the same
    1.
    发明授权
    Method for manufacturing semiconductor apparatus and mold assembly for the same 有权
    制造半导体装置的方法和用于其的模具组装

    公开(公告)号：US07998763B2

    公开(公告)日：2011-08-16

    申请号：US12619773

    申请日：2009-11-17

    申请人： Kazuyuki Iwasaki ,  Ryuichi Goto ,  Shogo Sakuma

    发明人： Kazuyuki Iwasaki ,  Ryuichi Goto ,  Shogo Sakuma

    IPC分类号： H01L21/00

    CPC分类号： H01L31/02327 ,  B29C45/02 ,  B29C45/14639 ,  H01L24/97 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2924/12043 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A method for manufacturing a semiconductor apparatus which does not hamper the miniaturization of products and can simplify the manufacturing process without the optical performance deteriorating is described. Furthermore, a mold assembly for use in molding a semiconductor apparatus can be provided. A substrate can be set within a lower mold, wherein a plurality of optical semiconductor elements are mounted on the substrate at predetermined intervals. Primary transfer molding using the lower mold and a primary upper mold can be carried out to form a plurality of frame bodies so as to surround the respective optical semiconductor elements. While the substrate is set on the lower mold, secondary transfer molding using the lower mold and the secondary upper mold can be carried out to form the light-transmitting portions so as to cover the optical semiconductor elements and the frame bodies on the substrate. Then, a multi-piece product of semiconductor apparatuses can be removed from the molds and cut by a dicer to separate the individual semiconductor apparatuses.

    摘要翻译： 描述了一种制造半导体装置的方法，该半导体装置不妨碍产品的小型化并且可以在不使光学性能恶化的情况下简化制造工艺。 此外，可以提供用于模制半导体装置的模具组件。 基板可以设置在下模具内，其中多个光学半导体元件以预定间隔安装在基板上。 可以进行使用下模和主上模的一次传递成型，以形成多个框体，以包围各个光半导体元件。 当基板设置在下模上时，可以执行使用下模和次上模的二次传递模塑，以形成光透射部分，以覆盖基板上的光半导体元件和框体。 然后，半导体装置的多件式产品可以从模具中取出并用切割机切割以分离各个半导体装置。

    METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND MOLD ASSEMBLY FOR THE SAME
    2.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND MOLD ASSEMBLY FOR THE SAME 有权
    用于制造半导体装置和模具组装的方法

    公开(公告)号：US20100124794A1

    公开(公告)日：2010-05-20

    申请号：US12619773

    申请日：2009-11-17

    申请人： Kazuyuki Iwasaki ,  Ryuichi Goto ,  Shogo Sakuma

    发明人： Kazuyuki Iwasaki ,  Ryuichi Goto ,  Shogo Sakuma

    IPC分类号： H01L33/44 ,  H01L21/78 ,  B29C45/14

    CPC分类号： H01L31/02327 ,  B29C45/02 ,  B29C45/14639 ,  H01L24/97 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2924/12043 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A method for manufacturing a semiconductor apparatus which does not hamper the miniaturization of products and can simplify the manufacturing process without the optical performance deteriorating is described. Furthermore, a mold assembly for use in molding a semiconductor apparatus can be provided. A substrate can be set within a lower mold, wherein a plurality of optical semiconductor elements are mounted on the substrate at predetermined intervals. Primary transfer molding using the lower mold and a primary upper mold can be carried out to form a plurality of frame bodies so as to surround the respective optical semiconductor elements. While the substrate is set on the lower mold, secondary transfer molding using the lower mold and the secondary upper mold can be carried out to form the light-transmitting portions so as to cover the optical semiconductor elements and the frame bodies on the substrate. Then, a multi-piece product of semiconductor apparatuses can be removed from the molds and cut by a dicer to separate the individual semiconductor apparatuses.

    摘要翻译： 描述了一种制造半导体装置的方法，该半导体装置不妨碍产品的小型化并且可以在不使光学性能恶化的情况下简化制造工艺。 此外，可以提供用于模制半导体装置的模具组件。 基板可以设置在下模具内，其中多个光学半导体元件以预定间隔安装在基板上。 可以进行使用下模和主上模的一次传递成型，以形成多个框体，以包围各个光半导体元件。 当基板设置在下模上时，可以执行使用下模和次上模的二次传递模塑，以形成光透射部分，以覆盖基板上的光半导体元件和框体。 然后，半导体装置的多件式产品可以从模具中取出并用切割机切割以分离各个半导体装置。