Low-profile MEMS thermal printhead die having backside electrical connections
    3.
    发明授权
    Low-profile MEMS thermal printhead die having backside electrical connections 有权
    具有背面电气连接的薄型MEMS热敏打印头芯片

    公开(公告)号:US08815626B2

    公开(公告)日:2014-08-26

    申请号:US14036869

    申请日:2013-09-25

    Applicant: Kateeva, Inc.

    Abstract: A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.

    Abstract translation: 热打印头芯片由作为MEMS器件的SOI结构形成。 模具具有印刷表面,掩埋氧化物层和与印刷表面相对的安装表面。 在打印表面上形成多个墨水输送部位,每个部位都具有墨水接收和墨水分配结构。 在每个结构附近形成欧姆加热器,并且在安装表面上形成凸块下金属化(UBM)焊盘,并与欧姆加热器电连接,使得由油墨传送部位接收的电和由 欧姆加热器可以通过升华被输送到基板。 可以通过芯片的厚度形成贯通硅通孔(TSV)插头,并通过掩埋氧化层从欧姆加热器电耦合到UBM焊盘。 互连金属层可以将欧姆加热器连接到UBM焊盘和TSV插头。

    Modular Printhead for OLED Printing
    9.
    发明申请
    Modular Printhead for OLED Printing 有权
    用于OLED打印的模块化打印头

    公开(公告)号:US20140057373A1

    公开(公告)日:2014-02-27

    申请号:US14072720

    申请日:2013-11-05

    Applicant: Kateeva, Inc.

    Abstract: The disclosure generally relates to a modular printhead configured for ease of access and quick replacement of the printhead. In one embodiment, the disclosure is directed to an integrated printhead which includes: a printhead die supporting a plurality of micropores thereon; a support structure for supporting the printhead die; a heater interposed between the printhead die and the support structure; and an electrical trace connecting the heater to a supply source. The support structure accommodates the electrical trace through a via formed within it so as to form a solid state printhead containing all of the connections within and providing easily replaceable printhead.

    Abstract translation: 本公开总体上涉及一种模块化打印头,其被配置为便于访问并快速更换打印头。 在一个实施例中,本公开涉及一种集成打印头,其包括:在其上支撑多个微孔的打印头芯片; 用于支撑打印头芯片的支撑结构; 介于所述打印头芯片和所述支撑结构之间的加热器; 以及将加热器连接到供应源的电迹线。 支撑结构通过其中形成的通孔来容纳电迹线,以便形成固态打印头,其中包含所有连接并提供易于更换的打印头。

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