公开(公告)号：US20230194382A1

公开(公告)日：2023-06-22

申请号：US17929482

申请日：2022-09-02

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yousuke HISAKUNI ,  Hidefumi TAKAMINE ,  Yuki UEDA ,  Keisuke UENO ,  Takashi USUI ,  Kazuo WATABE

IPC: G01M5/00 ,  G01M7/08

CPC classification number: G01M5/0066 ,  G01M5/0008 ,  G01M7/08

Abstract: According to one embodiment, a structure evaluation system includes an impact imparting unit, a plurality of sensors, a position locator, and an evaluator. The impact imparting unit applies impacts to a second region different from a first region of a structure to which traveling sections of a vehicle, which travels on the structure, apply impacts. The plurality of sensors detect elastic waves generated in the structure. The position locator locates a position of a source of the elastic waves on the basis of the elastic waves detected by each of the plurality of sensors. The evaluator evaluates a deterioration state of the structure on the basis of a position location result of the position locator.

公开(公告)号：US20190304511A1

公开(公告)日：2019-10-03

申请号：US16119944

申请日：2018-08-31

Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION

Inventor： Yousuke HISAKUNI ,  Nobuhiro YAMAMOTO ,  Kota TOKUDA

IPC: G11B33/14 ,  H05K1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H05K5/06 ,  G11B33/08

Abstract: According to one embodiment, an electronic apparatus includes, for example, a casing having an opening with a perimeter, and a circuit board including a first surface facing away from the casing and a second surface facing the casing, a first conductor which extends over the opening in the casing and at least a portion of which is located over the first surface, a second conductor at least portion of which extends over the second surface and is exposed to the interior of the casing at the opening in the casing, and a third conductor extending through the first surface and the second surface and electrically connected to the first conductor and the second conductor at a location outward of the perimeter of the opening.

公开(公告)号：US20230083554A1

公开(公告)日：2023-03-16

申请号：US17653291

申请日：2022-03-03

Applicant: Kabushiki Kaisha Toshiba

Inventor： Takashi USUI ,  Hidefumi TAKAMINE ,  Yuki UEDA ,  Keisuke UENO ,  Yousuke HISAKUNI ,  Kazuo WATABE

IPC: G01M7/08

Abstract: According to one embodiment, a structure evaluation system includes at least three or more sensors, a position locator, and an evaluator. The three or more sensors are arranged on surfaces different from a surface to which an impact is applied with respect to a structure at different intervals in a first direction of the structure and a second direction orthogonal to the first direction and detects elastic waves generated from the structure. The position locator locates a position of a source in which the elastic waves are generated on the basis of the elastic waves detected by each of the three or more sensors. The evaluator evaluates a deterioration state of the structure on the basis of information based on a position location process of the position locator and information indicating a position where the impact is applied.

公开(公告)号：US20200378823A1

公开(公告)日：2020-12-03

申请号：US16563662

申请日：2019-09-06

Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION

Inventor： Hirofumi OMOTE ,  Hiroshi OTA ,  Ryoji NINOMIYA ,  Yousuke HISAKUNI

IPC: G01H1/12 ,  G01H11/02 ,  G01H11/06

Abstract: According to one embodiment, a vibration detecting device includes a housing, a vibration sensor in the housing, a circuit board in the housing, a flexible wiring component, a first face, and a second face. The vibration sensor is housed in the housing. An electric component that processes a detection signal of the vibration sensor is provided on the circuit board. The wiring component electrically connects the vibration sensor and the circuit board. The first face is provided on the housing and is configured to be attached to an object. The second face is provided inside the housing and is inclined with respect to the first face, the vibration sensor being attached thereto.

公开(公告)号：US20170069559A1

公开(公告)日：2017-03-09

申请号：US15018547

申请日：2016-02-08

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Nobuhiro YAMAMOTO ,  Yousuke HISAKUNI

IPC: H01L23/367 ,  H01L27/108 ,  H01L27/115 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L23/04 ,  H01L23/3107 ,  H01L23/4006 ,  H01L23/49551 ,  H01L23/562 ,  H01L24/14 ,  H01L27/108 ,  H01L27/115 ,  H01L2924/15311 ,  H01L2924/351

Abstract: A semiconductor device includes a housing, a substrate housed in and fixed to the housing, and a semiconductor module package disposed on a surface of the substrate. A protrusion is formed on the housing, protrudes towards the substrate, located adjacent to the semiconductor module package, and directly or indirectly urges the substrate in a direction away from the protrusion.

Abstract translation: 半导体器件包括壳体，容纳在壳体中并固定到壳体的衬底以及设置在衬底的表面上的半导体模块封装。 在壳体上形成突起，朝向与半导体模块封装相邻的衬底突出，并且在远离突起的方向上直接或间接地推动衬底。