公开(公告)号：US20200253046A1

公开(公告)日：2020-08-06

申请号：US16263450

申请日：2019-01-31

Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Chuljong HAN ,  Minsuk OH ,  Eunji KO ,  Hongseon PARK

IPC: H05K1/05 ,  H05K3/46 ,  H05K3/28 ,  H05K1/02 ,  C03C17/40

Abstract: The present disclosure provides a composite conductive substrate exhibiting enhanced properties both in the folding endurance and the electric conductivity and a method of manufacturing the composite conductive substrate. A composite conductive substrate according to an exemplary embodiment of the present disclosure includes: an insulating layer; a metal nanowire structure embedded beneath one surface of the insulating layer; and a metal thin film coupled to the metal nanowire structure. The composite conductive substrate may be fabricated in an order of the insulating film, the metal nanowire structure, and the metal thin film, or vice versa.