公开(公告)号：US20190058157A1

公开(公告)日：2019-02-21

申请号：US16101583

申请日：2018-08-13

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Kyung Cheol CHOI ,  Jeong Hyun KWON

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56

CPC classification number: H01L51/5253 ,  H01L51/0097 ,  H01L51/5256 ,  H01L51/56 ,  H01L2251/5338

Abstract: Provided is an encapsulation structure for a transparent flexible organic electronic device, the encapsulation structure including a flexible substrate, and at least one hybrid unit structure provided on at least one surface of the flexible substrate and including a zinc oxide thin film, an aluminum oxide thin film, and a magnesium oxide thin film stacked on one another.