CURABLE SILOXANE RESIN COMPOSITION

    公开(公告)号:US20230078587A1

    公开(公告)日:2023-03-16

    申请号:US17726742

    申请日:2022-04-22

    Abstract: Provided is a curable siloxane composition with low dielectric constant and low dielectric loss, in which organic alkoxy silane having a silicon-based asymmetric structure and organic alkoxy silane having a silicon-based symmetric structure are included. The curable siloxane composition has low dielectric constant and dielectric loss in a high frequency range, low water absorption, excellent workability, and high copper foil peel strength, and thus physical properties suitable for application to printed circuit boards for high-frequency communication electronic devices may be provided.

    METHOD FOR PREPARING SEMICONDUCTOR NANOCRYSTAL SILOXANE COMPOSITE RESIN COMPOSITION

    公开(公告)号:US20180273838A1

    公开(公告)日:2018-09-27

    申请号:US15917956

    申请日:2018-03-12

    Abstract: The present invention relates to a method for preparing a semiconductor nanocrystal siloxane composite resin composition, and a cured product using the same. In the preparation method, the semiconductor nanocrystals are added during a non-hydrolytic sol-gel condensation reaction for forming a siloxane structure so that a siloxane resin having a dense inorganic network, which includes a siloxane bond, is encapsulated and thus is dispersed in the semiconductor nanocrystals through a chemical interaction and a chemical bond, thereby preventing a reduction in inherent characteristics (quantum efficiency) of the semiconductor nanocrystals resulting from an external oxidizing environment. Accordingly, when the curing of the resin composition is carried out, a cured product, which can be applied to various applications including a semiconductor nanocrystal siloxane composite having excellent reliability, can be provided.

    SILOXANE HARD COATING RESIN
    7.
    发明申请
    SILOXANE HARD COATING RESIN 有权
    硅氧烷硬化树脂

    公开(公告)号:US20130331476A1

    公开(公告)日:2013-12-12

    申请号:US13693143

    申请日:2012-12-04

    Abstract: The present invention relates to a siloxane hard resin including alicyclic epoxy siloxane alone or a reactive monomer, which is prepared by condensation reaction of alkoxysilanes, and has a weight average molecular weight in the range of 1000 to 4000 and a molecular weight distribution of PDI 1.05 to 1.4. A siloxane hard cured article produced by photo- or thermal polymerization has high hardness by compact crosslinking of siloxane molecules having different molecular weights.

    Abstract translation: 本发明涉及通过烷氧基硅烷的缩合反应制备的单独的脂环族环氧硅氧烷或反应性单体的硅氧烷硬质树脂,其重均分子量为1000〜4000,分子量分布为PDI 1.05 至1.4。 通过光聚合或热聚合制备的硅氧烷硬固化物质通过具有不同分子量的硅氧烷分子的紧密交联具有高硬度。

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