Substrate processing apparatus, method of manufacturing semiconductor device, and thermocouple support

    公开(公告)号:US11049742B2

    公开(公告)日:2021-06-29

    申请号:US16531540

    申请日:2019-08-05

    摘要: A substrate processing apparatus includes: a reaction tube configured to accommodate a substrate holder holding a plurality of substrates and process a substrate held on the substrate holder; a heating unit installed outside the reaction tube and configured to heat an inside of the reaction tube; a protection tube installed to extend in a vertical direction in contact with an outer wall of the reaction tube; an insulating tube disposed inside the protection tube and having through-holes extending in a vertical direction; a thermocouple having a thermocouple junction provided at an upper end thereof, and thermocouple wires joined at the thermocouple junction and inserted into the through-holes of the insulating tube; a gas supply unit configured to supply a gas, for processing a substrate accommodated in the reaction tube, into the reaction tube; and an exhaust unit configured to exhaust a gas from the reaction tube.

    Method of manufacturing semiconductor device, method of controlling temperature and non-transitory computer-readable recording medium

    公开(公告)号:US11158529B2

    公开(公告)日:2021-10-26

    申请号:US16283418

    申请日:2019-02-22

    摘要: There is provided a technique that includes (a) acquiring temperature data of at least one of a heater temperature defined by a temperature of a heater and a furnace temperature defined by an inner temperature of a process chamber, and acquiring a power supply value indicating an electric power supplied to the heater; (b) acquiring a reference temperature of the temperature data; (c) creating a predetermined equation using a prediction model of estimating a predicted temperature of the temperature data; (d) calculating a solution of minimizing a deviation between the reference temperature and the predicted temperature based on the predetermined equation; and (e) outputting a calculated power supply value calculated from the solution, and processing a substrate while controlling heating of the heater based on the calculated power supply value.