公开(公告)号：US10088345B1

公开(公告)日：2018-10-02

申请号：US13693769

申请日：2012-12-04

Applicant: KLA-Tencor Corporation

Inventor： Chuanyong Huang ,  Raymond Chu ,  Gordana Neskovic ,  Dieter Wilk ,  Christian Wolters ,  Tim Mahatdejkul

IPC: G01N21/88 ,  G01N21/00 ,  G01N21/47 ,  G01D18/00

Abstract: The present disclosure is directed to a method for designing an aperture in a mask for inspecting a wafer. The method includes the steps of scanning a collection plane of the wafer at a plurality of points and collecting data for at least a part of the wafer. The method also includes the step of mapping the data. A further step of the method includes configuring the aperture based on the mapped data.