公开(公告)号：US20180025952A1

公开(公告)日：2018-01-25

申请号：US15390473

申请日：2016-12-24

Applicant: KLA-Tencor Corporation

Inventor： Philip Measor ,  Robert Danen ,  Paul MacDonald

IPC: H01L21/66 ,  G01R31/28 ,  H01L21/306

CPC classification number: H01L22/22 ,  G01R31/2898 ,  H01L21/30608 ,  H01L21/30625 ,  H01L22/12 ,  H01L22/24 ,  H01L27/11582

Abstract: Reverse decoration can be used to detect defects in a device. The wafer can include NAND stacks or other devices. The defect can be a channel bridge, a void, or other types of defects. Reverse decoration can preserve a defect and/or can improve defect detection. A portion of a layer may be removed from a device. A layer also may be added to the device, such as on the defect, and some of the layer may be removed.

公开(公告)号：US10249546B2

公开(公告)日：2019-04-02

申请号：US15390473

申请日：2016-12-24

Applicant: KLA-Tencor Corporation

Inventor： Philip Measor ,  Robert Danen ,  Paul MacDonald

IPC: H01L21/66 ,  H01L21/306 ,  G01R31/28 ,  H01L27/11582

Abstract: Reverse decoration can be used to detect defects in a device. The wafer can include NAND stacks or other devices. The defect can be a channel bridge, a void, or other types of defects. Reverse decoration can preserve a defect and/or can improve defect detection. A portion of a layer may be removed from a device. A layer also may be added to the device, such as on the defect, and some of the layer may be removed.