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公开(公告)号:US20170287754A1
公开(公告)日:2017-10-05
申请号:US15451038
申请日:2017-03-06
Applicant: KLA-Tencor Corporation
Inventor: Jeremy Nabeth , Onur N. Demirer , Ramkumar Karur-Shanmugam , Choon George Hoong Hoo , Christian Sparka , Hoyoung Heo , Stuart Sherwin , Fatima Anis , Mark D. Smith , William Pierson
CPC classification number: H01L21/67259 , G01B11/002 , G01B11/272 , G01B2210/56 , G03F7/70633 , G03F9/7046 , G06F17/5009
Abstract: A semiconductor tool includes an illumination source to generate an illumination beam, one or more illumination optical elements to direct a portion of the illumination beam to a sample, a detector, one or more collection optical elements to direct radiation emanating from the sample to the detector, and a controller communicatively coupled to the detector. The controller is configured to measure alignment at a plurality of locations across the sample to generate alignment data, select an analysis area for alignment zone determination, divide the analysis area into two or more alignment zones having different alignment signatures; model the alignment data of at least a first alignment zone of the two or more alignment zones using a first alignment model, and model the alignment data of at least a second alignment zone of the two or more alignment zones using a second alignment model different than the first alignment model.
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公开(公告)号:US10340165B2
公开(公告)日:2019-07-02
申请号:US15451038
申请日:2017-03-06
Applicant: KLA-Tencor Corporation
Inventor: Jeremy Nabeth , Onur N. Demirer , Ramkumar Karur-Shanmugam , Choon (George) Hoong Hoo , Christian Sparka , Hoyoung Heo , Stuart Sherwin , Fatima Anis , Mark D. Smith , William Pierson
Abstract: A semiconductor tool includes an illumination source to generate an illumination beam, one or more illumination optical elements to direct a portion of the illumination beam to a sample, a detector, one or more collection optical elements to direct radiation emanating from the sample to the detector, and a controller communicatively coupled to the detector. The controller is configured to measure alignment at a plurality of locations across the sample to generate alignment data, select an analysis area for alignment zone determination, divide the analysis area into two or more alignment zones having different alignment signatures; model the alignment data of at least a first alignment zone of the two or more alignment zones using a first alignment model, and model the alignment data of at least a second alignment zone of the two or more alignment zones using a second alignment model different than the first alignment model.
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