公开(公告)号：US20180114732A1

公开(公告)日：2018-04-26

申请号：US15792705

申请日：2017-10-24

Applicant: KLA-Tencor Corporation

Inventor： Bobby R. Bell

IPC: H01L21/66 ,  H01L21/67

CPC classification number: H01L22/12 ,  G01N21/91 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/8809 ,  H01L21/67288 ,  H01L22/20 ,  H01L22/34

Abstract: Systems and methods for performing one or more processes on a specimen are provided. One system includes a deposition module incorporated into an existing tool configured to perform an inspection and/or metrology process. The deposition module is configured to deposit one or more materials on a specimen prior to the inspection and/or metrology process performed on the specimen. In some embodiments, the system also includes a stripping module incorporated into the existing tool, and the stripping module is configured to remove material(s) from the specimen subsequent to the inspection and/or metrology process performed on the specimen. The existing tool includes an illumination subsystem configured to direct light having one or more illumination wavelengths to the specimen; a detection subsystem configured to detect light from the specimen; and a computer subsystem configured to determine information for the specimen using output generated by the detection subsystem responsive to the detected light.

公开(公告)号：US10332810B2

公开(公告)日：2019-06-25

申请号：US15792705

申请日：2017-10-24

Applicant: KLA-Tencor Corporation

Inventor： Bobby R. Bell

IPC: H01L21/00 ,  H01L21/66 ,  H01L21/67 ,  G01N21/95

Abstract: Systems and methods for performing one or more processes on a specimen are provided. One system includes a deposition module incorporated into an existing tool configured to perform an inspection and/or metrology process. The deposition module is configured to deposit one or more materials on a specimen prior to the inspection and/or metrology process performed on the specimen. In some embodiments, the system also includes a stripping module incorporated into the existing tool, and the stripping module is configured to remove material(s) from the specimen subsequent to the inspection and/or metrology process performed on the specimen. The existing tool includes an illumination subsystem configured to direct light having one or more illumination wavelengths to the specimen; a detection subsystem configured to detect light from the specimen; and a computer subsystem configured to determine information for the specimen using output generated by the detection subsystem responsive to the detected light.