公开(公告)号：US20150243018A1

公开(公告)日：2015-08-27

申请号：US14630252

申请日：2015-02-24

Applicant: KLA-TENCOR CORPORATION

Inventor： Himanshu VAJARIA ,  Sina JAHANBIN ,  Bradley RIES ,  Mohan MAHADEVAN

IPC: G06T7/00 ,  G06K9/46 ,  G06K9/62 ,  G01N21/95

CPC classification number: G06T7/0004 ,  G01N21/9503 ,  G06K9/481 ,  G06K9/6204 ,  G06K2209/19 ,  G06T7/0006 ,  G06T7/13 ,  G06T7/62 ,  G06T2207/10024 ,  G06T2207/30148

Abstract: Shadow-grams are used for edge inspection and metrology of a stacked wafer. The system includes a light source that directs collimated light at an edge of the stacked wafer, a detector opposite the light source, and a controller connected to the detector. The stacked wafer can rotate with respect to the light source. The controller analyzes a shadow-gram image of the edge of the stacked wafer. Measurements of a silhouette of the stacked wafer in the shadow-gram image are compared to predetermined measurements. Multiple shadow-gram images at different points along the edge of the stacked wafer can be aggregated and analyzed.

Abstract translation: 阴影克用于堆叠晶片的边缘检查和计量。 该系统包括一个光源，它引导堆叠晶片的边缘处的准直光，与光源相对的检测器，以及连接到检测器的控制器。 堆叠的晶片可以相对于光源旋转。 控制器分析堆叠晶片边缘的阴影图像。 将影子图像中的堆叠晶片的轮廓的测量与预定的测量进行比较。 可以聚集和分析沿堆叠晶片边缘不同点的多个阴影图像。