公开(公告)号：US10304177B2

公开(公告)日：2019-05-28

申请号：US15600784

申请日：2017-05-21

Applicant: KLA-Tencor Corporation

Inventor： Pavan Kumar Perali ,  Hucheng Lee

IPC: G06T7/00 ,  G06T7/70

Abstract: Systems and methods for removing nuisance data from a defect scan of a wafer are disclosed. A processor receives a design file corresponding to a wafer having one or more z-layers. The processor receives critical areas of the wafer and instructs a subsystem to capture corresponding images of the wafer. Defect locations are received and the design file is aligned with the defect locations. Nuisance data is identified using the potential defect location and the one or more z-layers of the aligned design file. The processor then removes the identified nuisance data from the one or more potential defect locations.

公开(公告)号：US11195268B2

公开(公告)日：2021-12-07

申请号：US16117383

申请日：2018-08-30

Applicant: KLA-TENCOR CORPORATION

Inventor： Santosh Kumar ,  Pavan Kumar Perali

IPC: G06T7/00 ,  G01N23/2251 ,  H01L21/66 ,  H01L21/027

Abstract: Techniques and systems to achieve more accurate design alignment to an image by improved pixel-to-design alignment (PDA) target selection are disclosed. PDA targets in an image frame of a die can be biased to include a hotspot location in one of the PDA targets. The PDA targets can be evaluated for repetitive patterns by analyzing the uniqueness of the points used as the PDA targets.

公开(公告)号：US11295432B2

公开(公告)日：2022-04-05

申请号：US15969229

申请日：2018-05-02

Applicant: KLA-TENCOR CORPORATION

Inventor： Kaushik Reddy Vemareddy ,  Shishir Suman ,  Pavan Kumar Perali

IPC: G06T7/00 ,  G06T5/00

Abstract: A noise map is used for defect detection. One or more measurements of intensities at one or more pixels are received and an intensity statistic is determined for each measurement. The intensity statistics are grouped into at least one region and stored with at least one alignment target. A wafer can be inspected with a wafer inspection tool using the noise map. The noise map can be used as a segmentation mask to suppress noise.

公开(公告)号：US20180005367A1

公开(公告)日：2018-01-04

申请号：US15600784

申请日：2017-05-21

Applicant: KLA-Tencor Corporation

Inventor： Pavan Kumar Perali ,  Hucheng Lee

IPC: G06T7/00 ,  G06T7/70

CPC classification number: G06T7/0006 ,  G06T7/001 ,  G06T7/70 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Systems and methods for removing nuisance data from a defect scan of a wafer are disclosed. A processor receives a design file corresponding to a wafer having one or more z-layers. The processor receives critical areas of the wafer and instructs a subsystem to capture corresponding images of the wafer. Defect locations are received and the design file is aligned with the defect locations. Nuisance data is identified using the potential defect location and the one or more z-layers of the aligned design file. The processor then removes the identified nuisance data from the one or more potential defect locations.

公开(公告)号：US20190005638A1

公开(公告)日：2019-01-03

申请号：US15969229

申请日：2018-05-02

Applicant: KLA-TENCOR CORPORATION

Inventor： Kaushik Reddy Vemareddy ,  Shishir Suman ,  Pavan Kumar Perali

IPC: G06T7/00 ,  G06T5/00

Abstract: A noise map is used for defect detection. One or more measurements of intensities at one or more pixels are received and an intensity statistic is determined for each measurement. The intensity statistics are grouped into at least one region and stored with at least one alignment target. A wafer can be inspected with a wafer inspection tool using the noise map. The noise map can be used as a segmentation mask to suppress noise.