公开(公告)号：US20210375651A1

公开(公告)日：2021-12-02

申请号：US17246060

申请日：2021-04-30

Applicant: KLA Corporation

Inventor： Song Wu ,  Tianrong Zhan ,  Lie-Quan Lee

IPC: H01L21/67 ,  G01N21/95 ,  G05B19/418

Abstract: Methods and systems for calibrating metrology tool offset values to match measurement results across a fleet of metrology tools are presented herein. The calibration of offset values is based on measurements of inline, production wafers and does not require the use of specially fabricated and characterized quality control (QC) wafers. In this manner, the entire process flow to calibrate metrology tool offset values is automated and fully integrated within a high volume semiconductor fabrication process flow. In a further aspect, the implementation of a new offset value is regulated by one or more predetermined control limit values. In another further aspect, the measured values of a parameter of interest are adjusted to compensate for the effects of measurement time on the wafer under measurement.