公开(公告)号：US11682570B2

公开(公告)日：2023-06-20

申请号：US17479744

申请日：2021-09-20

Applicant: KLA Corporation

Inventor： Pradeep Vukkadala ,  Mark D. Smith ,  Ady Levy ,  Prasanna Dighe ,  Dieter Mueller

IPC: H01L21/67 ,  H01L21/66 ,  G01B11/06 ,  G01N21/45 ,  G03F7/20 ,  G05B19/4097 ,  G03F7/00

CPC classification number: H01L21/67253 ,  G01B11/0675 ,  G01N21/45 ,  G03F7/70483 ,  G05B19/4097 ,  H01L22/20 ,  G01B2210/56 ,  G05B2219/45031

Abstract: A controller is configured to perform at least a first characterization process prior to at least one discrete backside film deposition process on a semiconductor wafer; perform at least an additional characterization process following the at least one discrete backside film deposition process; determine at least one of a film force or one or more in-plane displacements for at least one discrete backside film deposited on the semiconductor wafer via the at least one discrete backside film deposition process based on the at least the first characterization process and the at least the additional characterization process; and provide at least one of the film force or the one or more in-plane displacements to at least one process tool via at least one of a feed forward loop or a feedback loop to improve performance of one or more fabrication processes.

公开(公告)号：US20220005714A1

公开(公告)日：2022-01-06

申请号：US17479744

申请日：2021-09-20

Applicant: KLA Corporation

Inventor： Pradeep Vukkadala ,  Mark D. Smith ,  Ady Levy ,  Prasanna Dighe ,  Dieter Mueller

IPC: H01L21/67 ,  G01B11/06 ,  G01N21/45 ,  G03F7/20 ,  G05B19/4097 ,  H01L21/66

Abstract: A controller is configured to perform at least a first characterization process prior to at least one discrete backside film deposition process on a semiconductor wafer; perform at least an additional characterization process following the at least one discrete backside film deposition process; determine at least one of a film force or one or more in-plane displacements for at least one discrete backside film deposited on the semiconductor wafer via the at least one discrete backside film deposition process based on the at least the first characterization process and the at least the additional characterization process; and provide at least one of the film force or the one or more in-plane displacements to at least one process tool via at least one of a feed forward loop or a feedback loop to improve performance of one or more fabrication processes.

公开(公告)号：US11360398B2

公开(公告)日：2022-06-14

申请号：US17087417

申请日：2020-11-02

Applicant: KLA Corporation

Inventor： Roie Volkovich ,  Paul MacDonald ,  Ady Levy ,  Jincheng Pei ,  Jinyan Song ,  Amnon Manassen

IPC: G03F7/20

Abstract: A metrology system includes a controller communicatively coupled to one or more metrology tools. In another embodiment, the controller includes one or more processors configured to execute program instructions causing the one or more processors to receive one or more overlay metrology measurements of one or more metrology targets of the metrology sample from the one or more metrology tools; determine tilt from the one or more measurement overlay measurements; and determine one or more correctables for at least one of one or more lithography tools or the one or more metrology tools to adjust for the tilt, where the one or more correctables are configured to reduce an amount of tilt in the sample or overlay inaccuracy of the one or more overlay metrology measurements. The program instructions further cause the one or more processors to predict tilt with a simulator based on at least the determined tilt.

公开(公告)号：US20210149313A1

公开(公告)日：2021-05-20

申请号：US17087417

申请日：2020-11-02

Applicant: KLA Corporation

Inventor： Roie Volkovich ,  Paul MacDonald ,  Ady Levy ,  Jincheng Pei ,  Jinyan Song ,  Amnon Manassen

IPC: G03F7/20

Abstract: A metrology system includes a controller communicatively coupled to one or more metrology tools. In another embodiment, the controller includes one or more processors configured to execute program instructions causing the one or more processors to receive one or more overlay metrology measurements of one or more metrology targets of the metrology sample from the one or more metrology tools; determine tilt from the one or more measurement overlay measurements; and determine one or more correctables for at least one of one or more lithography tools or the one or more metrology tools to adjust for the tilt, where the one or more correctables are configured to reduce an amount of tilt in the sample or overlay inaccuracy of the one or more overlay metrology measurements. The program instructions further cause the one or more processors to predict tilt with a simulator based on at least the determined tilt.