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公开(公告)号：US20230072716A1
公开(公告)日：2023-03-09
申请号：US17897222
申请日：2022-08-29
Applicant: KCTECH CO., LTD.
Inventor： Jung Hun KIM , Jeong Gyu LEE , Hyo Jun JANG
Abstract: The present disclosure relates to cerium oxide abrasive particles and a polishing slurry composition, and more particularly, to cerium oxide abrasive particles comprising: an element cerium; and a modifier and satisfying the agglomeration ratios calculated from the relational expressions of the primary particle sizes and the secondary particle sizes, and a polishing slurry composition comprising the same.
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