公开(公告)号：US20240375242A1

公开(公告)日：2024-11-14

申请号：US18469542

申请日：2023-09-18

Applicant: KCTECH CO., LTD.

Inventor： Ho Kyun LIM

IPC: B24B49/12 ,  B24B49/06 ,  H01L21/66

Abstract: A method of discrimination a wafer region and a wafer region discrimination apparatus performing the same are disclosed. A wafer region discrimination apparatus includes a probe including an optical sensor and configured to obtain optical spectrum signals of which signal values vary based on a thickness characteristic of a wafer at a plurality of positions on the wafer and a processor configured to identify whether a current optical spectrum signal is obtained from a die region on the wafer in which a chip is disposed using a region discrimination model based on a neural network that uses the current optical spectrum signal obtained by the probe as an input.