公开(公告)号：US09721905B2

公开(公告)日：2017-08-01

申请号：US15169246

申请日：2016-05-31

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Keiju Yamada ,  Takashi Yamazaki ,  Masatoshi Fukuda ,  Yasuhiro Koshio

IPC: H01L21/00 ,  H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L23/544

CPC classification number: H01L23/552 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: According to an embodiment, a semiconductor package includes a semiconductor chip mounted on an interposer board, a encapsulant sealing the semiconductor chip, and a conductive shielding layer covering the encapsulant and at least part of a side surface of the interposer board. The interposer board has plural vias through an insulating substrate. A part of the plural vias has a cutting plane exposing to the side surface of the interposer board and cut in a thickness direction of the interposer board. The cutting plane of the via is electrically connected to the conductive shielding layer.

公开(公告)号：US09165961B2

公开(公告)日：2015-10-20

申请号：US14191272

申请日：2014-02-26

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Mitsuhiro Iwama ,  Yasuhiro Koshio

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A solid-state imaging device includes a dielectric substrate, a solid-state imaging element disposed on the dielectric substrate, and including a photosensitive unit at a portion of a front surface thereof, an adhesive between the dielectric substrate and the solid-state imaging element, connection conductors, a sealant, and an upper package part. The solid-state imaging element includes a photosensitive unit at a portion of a front surface thereof, and is bonded to the dielectric substrate by the adhesive such that the adhesive is in contact with a portion of a rear surface of the solid-state imaging element so as to permit air flow along other portions of the rear surface of the solid-state image element. The connection conductors electrically connect the solid-state imaging element and the dielectric substrate. The upper package part is provided on the front surface of the solid-state imaging element so as to hermetically seal the photosensitive unit.

Abstract translation: 固态成像装置包括电介质基板，设置在电介质基板上的固态成像元件，并且在其表面的一部分处包括感光单元，电介质基板和固态成像元件之间的粘合剂 ，连接导体，密封剂和上包装部件。 固态成像元件在其前表面的一部分包括感光单元，并且通过粘合剂粘合到电介质基板，使得粘合剂与固态成像元件的后表面的一部分接触 以便允许空气沿着固态图像元件的后表面的其它部分流动。 连接导体将固态成像元件和电介质基板电连接。 上部封装部分设置在固态成像元件的前表面上，从而气密地密封感光单元。