知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

60 条记录 (耗时 0.024 秒)

    Light emitting diode substrate module and method of manufacturing the same, and backlight unit and method of manufacturing the same
    2.
    发明授权
    Light emitting diode substrate module and method of manufacturing the same, and backlight unit and method of manufacturing the same 失效
    发光二极管基板模块及其制造方法，以及背光单元及其制造方法

    公开(公告)号：US08132953B2

    公开(公告)日：2012-03-13

    申请号：US12244393

    申请日：2008-10-02

    申请人： Jung Kyu Park ,  Seong Ah Joo ,  Seung Hwan Choi

    发明人： Jung Kyu Park ,  Seong Ah Joo ,  Seung Hwan Choi

    IPC分类号： F21V7/04

    CPC分类号： G02F1/133603 ,  G02F1/133605 ,  G02F2001/133612 ,  H05K1/0274 ,  H05K1/053 ,  H05K1/092 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10S362/80

    摘要： There are provided a light emitting diode substrate module and a method of manufacturing the same, and a backlight unit and a method of manufacturing the same. A light emitting diode substrate module according to an aspect of the invention includes: a metal plate; an insulating film having a predetermined thickness and provided on an entire outer surface of the metal plate; a reflective film having a predetermined thickness and provided on an entire outer surface of the insulating film; and at least one light emitting diode package electrically connected to a driving circuit provided on the reflective film by pattern printing.Unnecessary material costs can be avoided by forming a predetermined driving circuit by pattern printing, and optical characteristics can be improved by stably maintaining reflection characteristics.

    摘要翻译： 提供了一种发光二极管衬底模块及其制造方法，以及背光单元及其制造方法。 根据本发明的一个方面的发光二极管衬底模块包括：金属板; 具有预定厚度并设置在金属板的整个外表面上的绝缘膜; 具有预定厚度并设置在绝缘膜的整个外表面上的反射膜; 以及通过图案印刷电连接到设置在反射膜上的驱动电路的至少一个发光二极管封装。 通过图案印刷形成预定的驱动电路可以避免不必要的材料成本，通过稳定地保持反射特性可以提高光学特性。

    High power LED package and fabrication method thereof
    3.
    发明授权
    High power LED package and fabrication method thereof 有权
    大功率LED封装及其制造方法

    公开(公告)号：US07875476B2

    公开(公告)日：2011-01-25

    申请号：US12612268

    申请日：2009-11-04

    申请人： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yeon Han ,  Dae Yeon Kim ,  Young Sam Park

    发明人： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yeon Han ,  Dae Yeon Kim ,  Young Sam Park

    IPC分类号： H01L21/00

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

    摘要翻译： LED二极管封装包括用于在其上表面上安装发光部分的热连接部分，同时保持热连接部分电连接到发光部分的框架和将热连接部分和框架固定在一起的模制部件。 发光部分响应于施加到其上的电流产生光，并且热连接部分的上表面超过模制部件的上表面突出到预定高度。 这可以优化光源的唯一光束角度，从而使照明效率最大化，并且防止在透镜的组装过程中封装材料的溢出，否则可能会污染相邻的部件。

    LED package and backlight assembly for LCD comprising the same
    4.
    发明授权
    LED package and backlight assembly for LCD comprising the same 失效
    用于LCD的LED封装和背光组件包括相同的

    公开(公告)号：US07560745B2

    公开(公告)日：2009-07-14

    申请号：US11674493

    申请日：2007-02-13

    申请人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    发明人： Hyung Suk Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong

    IPC分类号： H01L33/00 ,  F21V7/04 ,  G02F1/13357

    CPC分类号： H01L33/54 ,  G02F1/133603 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The LED package includes a substrate, one LED or more separated from each other by designated intervals and arranged in a line on the substrate, and a molding portion, for sealing the upper surface of the substrate including the LEDs, provided with an upper surface including two curved surfaces having circular circumferential shapes, wherein each of the curved surfaces has a curvature for totally reflecting light emitted from the LEDs. The LED package assures a sufficient optical traveling route therein without requiring a separate light guide plate, thereby emitting a white ray having uniform luminance.

    摘要翻译： LED封装包括基板，一个LED或更多的隔离指定间隔的LED或更多的布置在基板上的一行中的模制部分，以及用于密封包括LED的基板的上表面的模制部分，该模制部分设置有包括 两个具有圆周形状的曲面，其中每个曲面具有用于全反射从LED发射的光的曲率。 LED封装确保了其中的足够的光学行进路线，而不需要单独的导光板，从而发出具有均匀亮度的白光。

    LIGHT EMITTING DIODE PACKAGE WITH DIFFUSER AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    LIGHT EMITTING DIODE PACKAGE WITH DIFFUSER AND METHOD OF MANUFACTURING THE SAME 有权
    具有扩散器的发光二极管封装及其制造方法

    公开(公告)号：US20090155938A1

    公开(公告)日：2009-06-18

    申请号：US12370194

    申请日：2009-02-12

    申请人： Seong Yeon Han ,  Seon Goo Lee ,  Chang Ho Song ,  Jung Kyu Park ,  Young Sam Park ,  Kyung Taeg Han

    发明人： Seong Yeon Han ,  Seon Goo Lee ,  Chang Ho Song ,  Jung Kyu Park ,  Young Sam Park ,  Kyung Taeg Han

    IPC分类号： H01L21/56

    CPC分类号： H01L33/58 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.

    摘要翻译： 本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。 本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

    LCD Backlight unit and LCD having the same
    6.
    发明授权
    LCD Backlight unit and LCD having the same 有权
    LCD背光单元和LCD具有相同的功能

    公开(公告)号：US07221416B2

    公开(公告)日：2007-05-22

    申请号：US10997895

    申请日：2004-11-29

    申请人： Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong ,  Young Sam Park ,  Hyung Suk Kim ,  Ho Sik Ahn

    发明人： Hun Joo Hahm ,  Jung Kyu Park ,  Young June Jeong ,  Young Sam Park ,  Hyung Suk Kim ,  Ho Sik Ahn

    IPC分类号： G02F1/1335

    CPC分类号： G02B6/0028 ,  G02B5/021 ,  G02B5/0284 ,  G02B6/0018 ,  G02B6/003 ,  G02B6/0038 ,  G02B6/0068 ,  G02B6/0073

    摘要： An LCD backlight apparatus includes a light guide plate placed under an LCD panel of the LCD to guide light to the LCD panel. The light guide plate has an even upper surface and a scattering pattern formed in a bottom surface. A plurality of monochromatic light sources are placed in line at a side of the light guide plate to radiate light along the plane direction of the light guide plate between the upper and bottom surfaces of the light guide plate. The light sources are adapted to radiate light beams at a predetermined beam angle so that the light beams reach the scattering pattern only after having propagated a predetermined reference length necessary for forming white light when mixed together. The LCD backlight apparatus can reduce the Bezel width without increasing the thickness of the LCD.

    摘要翻译： LCD背光装置包括一个导光板，该导光板放置在LCD的LCD面板的下方，以将光引向LCD面板。 导光板具有均匀的上表面和形成在底面中的散射图案。 多个单色光源在导光板的一侧成直线放置，以在导光板的上表面和底表面之间沿着导光板的平面方向辐射光。 光源适于以预定的光束角辐射光束，使得光束仅在已经传播混合在一起形成白光所需的预定参考长度之后才到达散射图案。 LCD背光装置可以在不增加LCD的厚度的情况下减少边框宽度。

    Multi-lens light emitting diode
    7.
    发明授权
    Multi-lens light emitting diode 有权
    多镜头发光二极管

    公开(公告)号：US07153000B2

    公开(公告)日：2006-12-26

    申请号：US10957650

    申请日：2004-10-05

    申请人： Jung Kyu Park ,  Young Sam Park ,  Hun Joo Hahm ,  Young June Jeong ,  Hyung Suk Kim

    发明人： Jung Kyu Park ,  Young Sam Park ,  Hun Joo Hahm ,  Young June Jeong ,  Hyung Suk Kim

    IPC分类号： F21V3/02

    CPC分类号： H01L33/58 ,  G02F1/133603 ,  H01L33/54 ,  Y10S362/80

    摘要： A multi-lens LED has multiple lenses and an intermediate layer interposed between the multiple lenses in order to radiate light emitted from an LED chip in a desired direction and/or at a desired beam angle. The first lens is centered behind the LED chip when seen in the propagation direction of light. The second lens has a concave structure and surrounds the first lens. The intermediate layer is interposed between the first and second lenses, so that light emitted from the LED chip can be radiated at a wide beam angle. When provided in the form of a hemisphere, the multi-lens LED can be attached, e.g., to a wall or a ceiling for interior lighting. On the other hand, when provided in the form of a semicylinder, the multi-lens LEDs can be arranged in arrays to be used, e.g., as a light source of an LCD backlight apparatus.

    摘要翻译： 多透镜LED具有多个透镜和介于多个透镜之间的中间层，以便沿期望的方向和/或以期望的光束角辐射从LED芯片发射的光。 当在光的传播方向上观察时，第一透镜位于LED芯片的后面。 第二透镜具有凹形结构并围绕第一透镜。 中间层介于第一透镜和第二透镜之间，使得从LED芯片发出的光能够以宽的光束角度被辐射。 当以半球的形式提供时，多透镜LED可以例如附接到墙壁或天花板上用于室内照明。 另一方面，当以半圆柱形式提供时，多透镜LED可以排列成阵列以用作例如LCD背光装置的光源。

    Light emitting diode array module for providing backlight and backlight unit having the same
    9.
    发明申请
    Light emitting diode array module for providing backlight and backlight unit having the same 有权
    用于提供背光和背光单元的发光二极管阵列模块

    公开(公告)号：US20050243576A1

    公开(公告)日：2005-11-03

    申请号：US10890201

    申请日：2004-07-14

    申请人： Jung Kyu Park ,  Chang Wook Kim ,  Young Sam Park

    发明人： Jung Kyu Park ,  Chang Wook Kim ,  Young Sam Park

    IPC分类号： F21S2/00 ,  F21V5/00 ,  F21V5/04 ,  F21V7/04 ,  F21Y101/02 ,  G02F1/1335 ,  G02F1/13357 ,  H01L33/00 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60

    CPC分类号： G02F1/133603 ,  F21K9/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  Y10S362/80

    摘要： The present invention provides a Light Emitting Diode (LED) array module for providing backlight, which can be used as an independent device with a plurality of LEDs being integrally packaged, and which can be universally used regardless of a screen size, and a backlight unit having the same. The LED array module used as a light source of backlight includes a bar-shaped Printed Circuit Board (PCB) on which conductive patterns for transmitting power are formed, a base formed on the PCB and made of a heat conductive material, a plurality of LED chips mounted on the base in a line and electrically connected to the conductive patterns of the PCB, a reflector formed to surround the plurality of the LED chips and adapted to reflect light radiated from the plurality of LED chips upward, and a lens formed above the plurality of LED chips and reflector to have a bar shape and adapted to diffuse the light radiated from the plurality of LED chips and reflector in a horizontal direction.

    摘要翻译： 本发明提供了一种用于提供背光的发光二极管（LED）阵列模块，其可以用作具有整体封装的多个LED的独立装置，并且可以普遍使用，而不管屏幕尺寸如何，以及背光单元 有同样的 用作背光源的LED阵列模块包括形成有用于发射功率的导电图案的条形印刷电路板（PCB），形成在PCB上的由导热材料制成的基底，多个LED 芯片安装在基座上并与PCB的导电图形电连接，形成为围绕多个LED芯片的反射镜，并且适于反射从多个LED芯片向上辐射的光，以及形成在 多个LED芯片和反射器具有条形并且适于在水平方向上扩散从多个LED芯片和反射器辐射的光。