公开(公告)号：US20080191231A1

公开(公告)日：2008-08-14

申请号：US11995649

申请日：2006-12-28

申请人： Jun Seok Park ,  Yong Seok Choi

发明人： Jun Seok Park ,  Yong Seok Choi

IPC分类号： H01L27/32 ,  H01L21/329

CPC分类号： H05K1/0206 ,  G02F1/133603 ,  G02F1/133608 ,  G02F2001/133628 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/16 ,  H05K1/0204 ,  H05K3/4069 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/10727

摘要： Disclosed are a LED package, a method of fabricating the same, and a backlight unit having the same. The light emitting diode package comprises a light emitting diode, a printed circuit board provided with a circuit pattern used for driving the light emitting diode and a through hole formed in an area where the light emitting diode is mounted, and a heat sink provided in the through hole and contacted with a bottom surface of the light emitting diode.

摘要翻译： 公开了一种LED封装，其制造方法和具有该LED封装的背光单元。 发光二极管封装包括发光二极管，设置有用于驱动发光二极管的电路图案的印刷电路板和形成在安装有发光二极管的区域中的通孔，以及设置在该发光二极管的散热片 通孔并与发光二极管的底表面接触。

公开(公告)号：US08445926B2

公开(公告)日：2013-05-21

申请号：US11995649

申请日：2006-12-28

申请人： Jun Seok Park ,  Yong Seok Choi

发明人： Jun Seok Park ,  Yong Seok Choi

IPC分类号： H01L33/00

CPC分类号： H05K1/0206 ,  G02F1/133603 ,  G02F1/133608 ,  G02F2001/133628 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/16 ,  H05K1/0204 ,  H05K3/4069 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/10727

摘要： Disclosed are a LED package, a method of fabricating the same, and a backlight unit having the same. The light emitting diode package comprises a light emitting diode, a printed circuit board provided with a circuit pattern used for driving the light emitting diode and a through hole formed in an area where the light emitting diode is mounted, and a heat sink provided in the through hole and contacted with a bottom surface of the light emitting diode.

摘要翻译： 公开了一种LED封装，其制造方法和具有该LED封装的背光单元。 发光二极管封装包括发光二极管，设置有用于驱动发光二极管的电路图案的印刷电路板和形成在安装有发光二极管的区域中的通孔，以及设置在该发光二极管的散热片 通孔并与发光二极管的底表面接触。

公开(公告)号：US09425360B2

公开(公告)日：2016-08-23

申请号：US13114957

申请日：2011-05-24

申请人： Wan Ho Kim ,  Jun Seok Park

发明人： Wan Ho Kim ,  Jun Seok Park

IPC分类号： H01L33/48 ,  H01L33/38 ,  H01L33/08 ,  H01L33/56 ,  H01L33/58 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

CPC分类号： H01L33/385 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/49109 ,  H01L2924/1815 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

公开(公告)号：US09157815B2

公开(公告)日：2015-10-13

申请号：US13524794

申请日：2012-06-15

申请人： Ki Uk Kyung ,  Young Sung Kim ,  Sun Tak Park ,  Il Yeon Cho ,  Jun Seok Park

发明人： Ki Uk Kyung ,  Young Sung Kim ,  Sun Tak Park ,  Il Yeon Cho ,  Jun Seok Park

IPC分类号： G01L9/00 ,  G01L1/24 ,  G06F3/042

CPC分类号： G06F3/042 ,  G01D5/268 ,  G01L1/243 ,  G01L9/0077 ,  G06F3/0421 ,  G06F2203/04109

摘要： Disclosed are an apparatus and a method for sensing pressure using an optical waveguide sensor. The apparatus for sensing pressure using an optical waveguide sensor, includes: a light source radiating light; an optical waveguide panel emitting some of the radiated light outside through a plurality of light transmitting regions previously formed, and changing an amount of totally reflected light according to pressure applied to at least one of the plurality of light transmitting regions; a detector detecting the amount of light; and an analyzer determining intensity and a location of the pressure according to the detected amount of light.

摘要翻译： 公开了一种使用光波导传感器感测压力的装置和方法。 用于使用光波导传感器感测压力的装置包括：光源照射光; 通过预先形成的多个透光区域向外部发射一些辐射光的光波导面板，并且根据施加到多个透光区域中的至少一个的压力来改变全反射光量; 检测光量的检测器; 以及根据检测到的光量来确定压力的强度和位置的分析器。

公开(公告)号：US08878215B2

公开(公告)日：2014-11-04

申请号：US13412820

申请日：2012-03-06

申请人： Jun Seok Park ,  Ho Jin Lee

发明人： Jun Seok Park ,  Ho Jin Lee

IPC分类号： H01L33/60 ,  H01L33/52

CPC分类号： H01L33/54 ,  H01L33/002 ,  H01L33/06 ,  H01L33/10 ,  H01L33/44 ,  H01L33/48 ,  H01L33/483 ,  H01L33/507 ,  H01L33/52 ,  H01L33/58 ,  H01L33/62 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： Disclosed is a light emitting device module. The light emitting device module includes a first lead frame and a second lead frame electrically separated from each other, a light emitting device electrically connected to the first lead frame and the second lead frame, the light emitting device includes a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer, a dam disposed at the peripheral area of the light emitting device, a resin layer surrounding the light emitting device and disposed at the inner area of the dam, and a reflective member disposed at the peripheral area of the dam and including an inclined plane formed on at least one side surface thereof.

摘要翻译： 公开了一种发光器件模块。 发光器件模块包括彼此电分离的第一引线框架和第二引线框架，电连接到第一引线框架和第二引线框架的发光器件，发光器件包括发光结构，其具有第一 导电型半导体层，有源层和第二导电型半导体层，设置在发光器件的周边区域的堤坝，围绕发光器件并设置在坝的内部区域的树脂层，以及 反射构件设置在坝的周边区域并且包括形成在其至少一个侧表面上的倾斜平面。

公开(公告)号：US08759846B2

公开(公告)日：2014-06-24

申请号：US12671179

申请日：2008-08-11

申请人： Jun Seok Park

发明人： Jun Seok Park

IPC分类号： H01L29/18 ,  H01L33/64 ,  H05K1/02

CPC分类号： H01L33/641 ,  H01L33/642 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2924/00011 ,  H05K1/0206 ,  H05K1/0209 ,  H05K2201/0209 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049

摘要： A light emitting device is provided. The light emitting device comprises a substrate, a first lead frame and a second lead frame on the substrate, a first light emitting diode, a heat conductor on the substrate, and a heat transfer pad. The first light emitting diode on the first lead frame is electrically connected to the first lead frame and the second lead frame. The heat conductor is electrically separated from the first lead frame. The heat transfer pad contacts the first lead frame and the heat conductor thermally to connect the first lead frame to the heat conductor.

摘要翻译： 提供了一种发光器件。 发光器件包括衬底，衬底上的第一引线框和第二引线框，第一发光二极管，衬底上的导热体和传热垫。 第一引线框架上的第一发光二极管电连接到第一引线框架和第二引线框架。 热导体与第一引线框架电分离。 传热垫与第一引线框架和热导体热接触，以将第一引线框架连接到热导体。

公开(公告)号：US08692265B2

公开(公告)日：2014-04-08

申请号：US13545788

申请日：2012-07-10

申请人： Jun Seok Park

发明人： Jun Seok Park

IPC分类号： H01L29/20

CPC分类号： H05K1/141 ,  G02F1/133603 ,  G02F1/133608 ,  G02F1/133611 ,  G02F2001/133601 ,  G02F2001/133612 ,  G02F2001/133613 ,  G02F2203/68 ,  H05K2201/10106

摘要： A lighting device is provided. The lighting device comprises a first substrate and a plurality of second substrates. The plurality of second substrates are separately and electrically connected to the first substrate and comprise a light emitting device.

摘要翻译： 提供照明装置。 照明装置包括第一基板和多个第二基板。 多个第二基板分别电连接到第一基板并且包括发光器件。

公开(公告)号：US08480251B2

公开(公告)日：2013-07-09

申请号：US13586373

申请日：2012-08-15

申请人： Jun Seok Park

发明人： Jun Seok Park

IPC分类号： F21V5/00 ,  F21V21/00 ,  F21V7/00

CPC分类号： F21K9/30 ,  F21K9/20 ,  F21K9/60 ,  F21K9/62 ,  F21V21/005 ,  G02F1/133603 ,  G02F1/133606 ,  G02F1/133608 ,  G02F2201/34 ,  G02F2201/52

摘要： A backlight assembly includes: a light emitting unit having a plurality of unit LEDs formed in a matrix, each of the unit LEDs having a red LED, a green LED, and a blue LED; a plurality of bottom reflectors disposed under the respective unit LEDs; and a plurality of side reflectors disposed around the respective unit LEDs.

摘要翻译： 背光组件包括：具有以矩阵形式形成的多个单位LED的发光单元，每个单元LED具有红色LED，绿色LED和蓝色LED; 设置在各单位LED的下方的多个底部反射器; 以及设置在各单元LED周围的多个侧面反射器。

公开(公告)号：US08415696B2

公开(公告)日：2013-04-09

申请号：US12784283

申请日：2010-05-20

申请人： Jun Seok Park

发明人： Jun Seok Park

IPC分类号： H01L29/22

CPC分类号： F21V5/04 ,  F21K9/69 ,  F21V5/045 ,  F21V29/70 ,  F21Y2115/10 ,  G02B5/1876 ,  G02B5/1885 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H05K1/056 ,  H01L2924/00014 ,  H01L2924/00

摘要： There are provided a light emitting device package and a method for manufacturing the same. The light emitting device includes: a plurality of barriers provided above a metal circuit board; a plurality of light emitting devices placed in a space between the barriers; and a lens unit provided at an upper side of the barrier. Accordingly, the plurality of light emitting devices can be conveniently seated as a module format, and a luminance can be increased. Also, an efficiency of heat sink can be increase.

公开(公告)号：US08395178B2

公开(公告)日：2013-03-12

申请号：US12788064

申请日：2010-05-26

申请人： Jun Seok Park ,  Seok Hoon Kang

发明人： Jun Seok Park ,  Seok Hoon Kang

IPC分类号： H01L33/00

CPC分类号： H01L33/64 ,  B29C45/14655 ,  B29C45/34 ,  H01L24/97 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2224/85

摘要： A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.

摘要翻译： 提供发光器件封装和制造发光器件封装的方法。 首先设置基座，并在基座上形成孔。 在基底上形成发光部之后，在发光部上配置模具，通过该孔注入成形材料。 去除模具以完成包装。