摘要:
Data transmission system and method are provided. The transmission system includes a data converter and data restoring unit. The data converter converts N-bit first data to be transmitted into M-bit second data, where M is greater than N and the second data is arranged in a minimum unit greater than 1, each minimum unit including at least successive data bits having the same phase. The transmitter compresses the second data prior to transmission via a channel having performance characteristics defining a minimum pulse width, and a receiver receives and de-compresses the transmitted second data. The data restoring unit then restores the first data from the second.
摘要:
A semiconductor device, a method related to the semiconductor device, and a printed circuit board are disclosed. The semiconductor device includes a chip, a package including a plurality of power voltage terminals and a plurality of ground voltage terminals, wherein the chip is disposed in the package. The semiconductor device further includes an impedance circuit connected between a DC component power voltage terminal and a ground voltage, wherein the DC component power voltage terminal is one of the plurality of power voltage terminals, and an AC component interrupter connected between the DC component power voltage terminal and a power voltage. Both the AC component and a DC component of the power voltage are applied to each of the power voltage terminals except the DC component second power voltage terminal, and the ground voltage is applied to each of the ground voltage terminals.
摘要:
A termination circuit is connected to an input buffer receiving a data signal, and includes at least one termination resistor connected to the input buffer for impedance matching. At least one switch controls a connection between the input buffer and a corresponding one of the at least one termination resistors. A control signal generator generates a control signal for selectively enabling the termination circuit by controlling each of the at least one switches. The control signal has an input period less than or equal to an input period of a data signal.
摘要:
A termination circuit is connected to an input buffer receiving a data signal, and includes at least one termination resistor connected to the input buffer for impedance matching. At least one switch controls a connection between the input buffer and a corresponding one of the at least one termination resistors. A control signal generator generates a control signal for selectively enabling the termination circuit by controlling each of the at least one switches. The control signal has an input period less than or equal to an input period of a data signal.
摘要:
Data transmission system and method are provided. The transmission system includes a data converter and data restoring unit. The data converter converts N-bit first data to be transmitted into M-bit second data, where M is greater than N and the second data is arranged in a minimum unit greater than 1, each minimum unit including at least successive data bits having the same phase. The transmitter compresses the second data prior to transmission via a channel having performance characteristics defining a minimum pulse width, and a receiver receives and de-compresses the transmitted second data. The data restoring unit then restores the first data from the second.
摘要:
A semiconductor device, a method related to the semiconductor device, and a printed circuit board are disclosed. The semiconductor device includes a chip, a package including a plurality of power voltage terminals and a plurality of ground voltage terminals, wherein the chip is disposed in the package. The semiconductor device further includes an impedance circuit connected between a DC component power voltage terminal and a ground voltage, wherein the DC component power voltage terminal is one of the plurality of power voltage terminals, and an AC component interrupter connected between the DC component power voltage terminal and a power voltage. Both the AC component and a DC component of the power voltage are applied to each of the power voltage terminals except the DC component second power voltage terminal, and the ground voltage is applied to each of the ground voltage terminals.
摘要:
A printed circuit board (PCB) includes a substrate having a first group of at least two via holes and a second group of at least two via holes formed therein, a first pad set of terminal pads and a second pad set of terminal pads formed on the substrate, and a first group of conductive connection members and a second group of conductive connection members formed in the substrate. The first group of the via holes are surrounded by the first pad set of the terminal pads and the second group of the via holes are surrounded by the second pad set of the terminal pads. The first and the second groups of conductive connection members fill up the first and second groups of the via holes. The first group of the conductive connection members are connected to the first pad set of the terminal pads and the second group of the conductive connection members are connected to the second pad set of the terminal pads.
摘要:
A printed circuit board (PCB) includes a substrate having a first group of at least two via holes and a second group of at least two via holes formed therein, a first pad set of terminal pads and a second pad set of terminal pads formed on the substrate, and a first group of conductive connection members and a second group of conductive connection members formed in the substrate. The first group of the via holes are surrounded by the first pad set of the terminal pads and the second group of the via holes are surrounded by the second pad set of the terminal pads. The first and the second groups of conductive connection members fill up the first and second groups of the via holes. The first group of the conductive connection members are connected to the first pad set of the terminal pads and the second group of the conductive connection members are connected to the second pad set of the terminal pads.
摘要:
A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the first and second primary and first and second secondary memories. A first connection element, such as a connector or solder, connects the memory module to a mother board. A second connection element, such as a connector or solder, connects at least one other of the first and second primary and first and second secondary memories to the mother board. At least one of the memories on the first memory module is coupled to at least one of the other memories. The memory system also includes a memory controller which is connected to the primary memories by a point-to-two-point link.
摘要:
A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the first and second primary and first and second secondary memories. A first connection element, such as a connector or solder, connects the memory module to a mother board. A second connection element, such as a connector or solder, connects at least one other of the first and second primary and first and second secondary memories to the mother board. At least one of the memories on the first memory module is coupled to at least one of the other memories. The memory system also includes a memory controller which is connected to the primary memories by a point-to-two-point link.