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公开(公告)号:US20210391602A1
公开(公告)日:2021-12-16
申请号:US17284466
申请日:2019-10-15
发明人: Craig Kennedy , Vu Phan
IPC分类号: H01M10/48 , H01M10/42 , H01M50/507 , H01M50/522 , H01M50/519
摘要: A battery module having a plurality of battery cells disposed in a housing and interconnected by upper and lower interconnect panels stamped from sheets of conductive metal. Each of the upper and lower interconnect panels have a plurality of contacts secured to terminals of the battery cells, respectively. The contacts are at least partially disposed in panel openings extending through the upper and lower interconnect panels. A carrier is provided and includes a lead frame molded into a body of thermoplastic resin. The lead frame connects a plurality of locations on the upper and lower interconnect panels to a monitoring module that measures physical properties at the locations.
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公开(公告)号:US10779392B2
公开(公告)日:2020-09-15
申请号:US16580507
申请日:2019-09-24
发明人: Richard Schneider , Joseph J. Lynch , Craig Kennedy , Vu Phan
摘要: An electrical assembly having an electrical device electrically connected to a multilayer bus board, which has a multilayer stacked assembly that includes a plurality of electrically conductive layer structures and at least one dielectric layer structure disposed between an adjacent pair of the conductive layer structures. A frame formed of a dielectric material encapsulates at least a portion of the multilayer stacked assembly and mechanically maintains the conductive layer structures and the dielectric layer structure in secure aligned abutting relation.
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公开(公告)号:US20200060022A1
公开(公告)日:2020-02-20
申请号:US16580507
申请日:2019-09-24
发明人: Richard Schneider , Joseph J. Lynch , Craig Kennedy , Vu Phan
摘要: An electrical assembly having an electrical device electrically connected to a multilayer bus board, which has a multilayer stacked assembly that includes a plurality of electrically conductive layer structures and at least one dielectric layer structure disposed between an adjacent pair of the conductive layer structures. A frame formed of a dielectric material encapsulates at least a portion of the multilayer stacked assembly and mechanically maintains the conductive layer structures and the dielectric layer structure in secure aligned abutting relation.
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公开(公告)号:US11901524B2
公开(公告)日:2024-02-13
申请号:US17284466
申请日:2019-10-15
发明人: Craig Kennedy , Vu Phan
IPC分类号: H01M10/48 , H01M50/519 , H01M50/507 , H01M50/522 , H01M10/42 , H01M50/569 , H01M50/50
CPC分类号: H01M10/482 , H01M10/425 , H01M10/486 , H01M50/50 , H01M50/507 , H01M50/519 , H01M50/522 , H01M50/569 , H01M2220/20
摘要: A battery module having a plurality of battery cells disposed in a housing and interconnected by upper and lower interconnect panels stamped from sheets of conductive metal. Each of the upper and lower interconnect panels have a plurality of contacts secured to terminals of the battery cells, respectively. The contacts are at least partially disposed in panel openings extending through the upper and lower interconnect panels. A carrier is provided and includes a lead frame molded into a body of thermoplastic resin. The lead frame connects a plurality of locations on the upper and lower interconnect panels to a monitoring module that measures physical properties at the locations.
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