公开(公告)号：US20150208555A1

公开(公告)日：2015-07-23

申请号：US14611684

申请日：2015-02-02

申请人： International Business Machines Corporation

发明人： Matteo Flotta ,  Yves C. Martin ,  Lubomyr T. Romankiw ,  Theodore G. van Kessel

IPC分类号： H05K7/20

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H05K7/20327 ,  H05K7/20381 ,  H05K7/20772 ,  H01L2924/00

摘要： In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.

公开(公告)号：US09887146B2

公开(公告)日：2018-02-06

申请号：US14611684

申请日：2015-02-02

申请人： International Business Machines Corporation

发明人： Matteo Flotta ,  Yves C. Martin ,  Lubomyr T. Romankiw ,  Theodore G. van Kessel

IPC分类号： H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H05K7/20327 ,  H05K7/20381 ,  H05K7/20772 ,  H01L2924/00

摘要： In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.