Invention Grant
- Patent Title: Method and apparatus for chip cooling
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Application No.: US14611684Application Date: 2015-02-02
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Publication No.: US09887146B2Publication Date: 2018-02-06
- Inventor: Matteo Flotta , Yves C. Martin , Lubomyr T. Romankiw , Theodore G. van Kessel
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Louis Percello
- Main IPC: H01L23/473
- IPC: H01L23/473 ; H05K7/20

Abstract:
In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.
Public/Granted literature
- US20150208555A1 METHOD AND APPARATUS FOR CHIP COOLING Public/Granted day:2015-07-23
Information query
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