公开(公告)号：US20130161822A1

公开(公告)日：2013-06-27

申请号：US13776781

申请日：2013-02-26

申请人： International Business Machines Corporation

发明人： Stephane S. Barbeau ,  Catherine C. Dufort ,  Ian D. Melville ,  Luc L. Ouellet ,  Marie-Claude Paquet ,  Wolfgang Sauter ,  Jeffrey S. Zimmerman

IPC分类号： H01L23/488

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/94 ,  H01L2224/131 ,  H01L2224/16235 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/325 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/8312 ,  H01L2224/83855 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00

摘要： A method forms an integrated circuit structure, using a manufacturing device, to have kerf regions and external contacts, and to have conductive structures in the kerf regions. The method also forms an underfill material on a surface of the integrated circuit structure, using the manufacturing device, that contacts the kerf regions and the external contacts. The underfill material comprises electrically attracted filler particles that affect the coefficient of thermal expansion and elastic modulus of the underfill material. When forming the underfill material, the method applies an electrical charge to the conductive structures and the external contacts.

摘要翻译： 一种方法使用制造装置形成集成电路结构，以具有切口区域和外部触点，并且在切口区域中具有导电结构。 该方法还使用与切口区域和外部接触件接触的制造装置在集成电路结构的表面上形成底部填充材料。 底部填充材料包括影响底部填充材料的热膨胀系数和弹性模量的电吸引填料颗粒。 当形成底部填充材料时，该方法对导电结构和外部触点施加电荷。