公开(公告)号：US11585871B1

公开(公告)日：2023-02-21

申请号：US17643985

申请日：2021-12-13

申请人： International Business Machines Corporation

发明人： Oki Gunawan ,  Devendra K. Sadana ,  Douglas Bishop ,  Tze-Chiang Chen

IPC分类号： G01R33/07

摘要： A system for and methods of semiconductor testing and characterization are disclosed. The system includes a parallel dipole line (PDL) system for applying a magnetic field to a sample in a measurement chamber and electrical equipment for testing the sample. The testing includes applying a first light exposure to the sample with the PDL system set to zero magnetic field and monitoring longitudinal resistance (Rxx) of the sample as intensity of the first light exposure varies. A second light exposure is applied with the PDL system set to maximum magnetic field, and transverse magnetoresistance (RB+) is monitored as light intensity varies. A third light exposure is applied with the PDL system set to minimum magnetic field, and transverse magnetoresistance (RB−) is monitored as light intensity varies. The characterization includes carrying out a photo-Hall analysis based on data from the testing.

公开(公告)号：US20220277964A1

公开(公告)日：2022-09-01

申请号：US17186064

申请日：2021-02-26

申请人： International Business Machines Corporation

发明人： Mahadevaiyer Krishnan ,  Michael Francis Lofaro ,  Andrew Giannetta ,  Douglas Bishop ,  Eugene J. O'Sullivan ,  Daniel Charles Edelstein

IPC分类号： H01L21/321 ,  H01L21/768 ,  C09G1/02

摘要： A method for planarizing a metal conductor layer embedded in a dielectric layer is provided. The method includes removing a portion of an overburden of the metal conductor layer that is formed over the dielectric layer with a first CMP slurry. The method also includes removing a remaining portion of the overburden of the metal conductor layer with a second CMP slurry to expose upper portions of the dielectric layer.