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    COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES
    2.
    发明申请
    COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES 有权

    公开(公告)号：US20210105911A1

    公开(公告)日：2021-04-08

    申请号：US17123760

    申请日：2020-12-16

    申请人： Intel Corporation

    发明人： Jin YANG ,  David SHIA ,  Mohanraj PRABHUGOUD ,  Olaotan ELENITOBA-JOHNSON ,  Craig JAHNE ,  Phil GENG

    IPC分类号： H05K7/20

    摘要： Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.

    DUAL IN-LINE MEMORY MODULE RETAINER
    3.
    发明公开
    DUAL IN-LINE MEMORY MODULE RETAINER 审中-公开

    公开(公告)号：US20240242740A1

    公开(公告)日：2024-07-18

    申请号：US18622813

    申请日：2024-03-29

    申请人： Intel Corporation

    发明人： Phil GENG ,  Xiang LI ,  George VERGIS

    IPC分类号： G11C5/04 ,  H05K1/14 ,  H05K1/18

    CPC分类号： G11C5/04 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/10159 ,  H05K2201/10189

    摘要： A retainer to inhibit movement of dual in-line memory modules (DIMMs) that are removably inserted into connectors attached to a printed circuit board (PCB) of a system. Inhibiting movement of the DIMMs, especially taller DIMMs, such as the higher height 2 U and 4 U DIMMs, mitigates the effects of operational vibration causing intermittent electrical discontinuity between DIMM and the PCB. The retainer inhibits movement of DIMMs at the connector component level by constraining all or a portion of top edges of DIMMs inserted into connectors. The retainer is implemented independently of the design of the system-level chassis. The retainer is shaped into any of a bracket or frame from multiple rigid horizontal, vertical and oblique members that permit airflow to the DIMMs and connectors retained therein.

    COOLING ASSEMBLY WITH DAMPENED OSCILLATION RESPONSE
    10.
    发明申请
    COOLING ASSEMBLY WITH DAMPENED OSCILLATION RESPONSE 有权

    公开(公告)号：US20220117079A1

    公开(公告)日：2022-04-14

    申请号：US17555250

    申请日：2021-12-17

    申请人： Intel Corporation

    发明人： Phil GENG ,  Jeffory L. SMALLEY ,  Sandeep AHUJA ,  Ralph V. MIELE ,  David SHIA

    IPC分类号： H05K1/02 ,  H05K7/20 ,  H05K1/18

    摘要： An apparatus is described. The apparatus includes a semiconductor chip package assembly having a spring element to be coupled between a first mechanical element and a second mechanical element to apply a loading force that pulls the first and second mechanical elements toward each other in the assembly's nominal assembled state. The first and second elements to support a cooling mass, the assembly further comprising a dampener that is coupled to at least one of the first and second mechanical elements to reduce oscillation amplitude of the cooling mass.