公开(公告)号：US20210321543A1

公开(公告)日：2021-10-14

申请号：US17357776

申请日：2021-06-24

申请人： Intel Corporation

发明人： Guixiang TAN ,  Xiang LI ,  Jimmy CHUANG ,  Devdatta P. KULKARNI ,  Casey WINKEL ,  Evan A. CHENELLY

IPC分类号： H05K7/20 ,  G06F1/20 ,  G11C5/04

摘要： An apparatus is described. The apparatus includes a module to be inserted into an electronic system. The module includes a first heat exchanger at one end of the module and second heat exchanger at another end of the module. The module also includes a first vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a first side of the module and a second vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a second side of the module. The first heat exchanger is in thermal contact with at least one of the first and second vapor chambers, and, the second heat exchanger is in thermal contact with at least one of the first and second vapor chambers.

公开(公告)号：US20220117080A1

公开(公告)日：2022-04-14

申请号：US17555340

申请日：2021-12-17

申请人： Intel Corporation

发明人： Phil GENG ,  Sandeep AHUJA ,  Ralph V. MIELE ,  David SHIA ,  Jeffory L. SMALLEY ,  Casey WINKEL

IPC分类号： H05K1/02 ,  H01L23/40 ,  H05K1/18

摘要： An apparatus is described. The apparatus includes a ball grid array (BGA) chip package cooling assembly includes a back plate and a bolster plate. The bolster plate has frame arms. The BGA chip package is to be placed in a window formed by the frame arms and soldered to a region of a printed circuit board. The frame arms surround the region. The printed circuit board is to be subjected to a compressive force between the back plate and the bolster plate.

公开(公告)号：US20210043537A1

公开(公告)日：2021-02-11

申请号：US16986122

申请日：2020-08-05

申请人： Intel Corporation

发明人： Barrett M. FANEUF ,  Phil GENG ,  Kenan ARIK ,  David SHIA ,  Casey WINKEL ,  Sandeep AHUJA ,  Eric D. MCAFEE ,  Jeffory L. SMALLEY ,  Minh T.D. LE ,  Ralph V. MIELE ,  Marc MILOBINSKI ,  Aaron P. ANDERSON ,  Brendan T. PAVELEK

IPC分类号： H01L23/367 ,  G11C5/06 ,  H05K7/14 ,  H05K7/20

摘要： An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

公开(公告)号：US20210120670A1

公开(公告)日：2021-04-22

申请号：US17134028

申请日：2020-12-24

申请人： Intel Corporation

发明人： Guixiang TAN ,  Xiang LI ,  Casey WINKEL ,  George VERGIS

IPC分类号： H05K1/11 ,  H05K5/02 ,  H05K5/00 ,  H05K7/20

摘要： An apparatus is described. The apparatus includes a printed circuit board (PCB) dual in-line memory module (DIMM) connector having ejectors. The ejectors have a small enough vertical profile to permit unbent liquid cooling conduits to run across the DIMM's semiconductor chips.