公开(公告)号：US20240097079A1

公开(公告)日：2024-03-21

申请号：US17949857

申请日：2022-09-21

Applicant: Intel Corporation

Inventor： Brandon C. MARIN ,  Khaled AHMED ,  Srinivas V. PIETAMBARAM ,  Hiroki TANAKA ,  Paul WEST ,  Kristof DARMAWIKARTA ,  Gang DUAN ,  Jeremy D. ECTON ,  Suddhasattwa NAD

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/00 ,  H01L33/32 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/0075 ,  H01L33/32 ,  H01L33/62 ,  H01L2933/0066

Abstract: Integrated circuit (IC) packages are disclosed. In some embodiments, an IC package includes a glass substrate, a micro light emitting diode (LED), a semiconductor die, one or more through glass vias (TGVs) and a package substrate. The micro LED is positioned over the glass substrate. The TGVs are integrated into the glass substrate and connect the micro LED to the semiconductor die. The semiconductor die is connected to the package substrate to receive external signals when connected to a motherboard.