公开(公告)号：US11573055B2

公开(公告)日：2023-02-07

申请号：US16728812

申请日：2019-12-27

申请人： Intel Corporation

发明人： Juha Tapani Paavola ,  Mark Carbone ,  Vivek Paranjape ,  Prakash Kurma Raju ,  Mikko Antero Makinen ,  Christopher M. Moore ,  Gustavo Fricke ,  Kathiravan D ,  Ritu Bawa ,  Nehakausar Shaikh Ramjan Pinjari ,  Hari Shanker Thakur

IPC分类号： F28D15/04 ,  H01L23/427 ,  H05K7/20

摘要： Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.

公开(公告)号：USD980842S1

公开(公告)日：2023-03-14

申请号：US29747663

申请日：2020-08-24

申请人： Intel Corporation

设计人： Prakash Kurma Raju ,  Ajay Kumar Vaidhyanathan ,  Bala Subramanya ,  Gurpreet Singh Sandhu ,  Navneet Kumar Singh ,  Nehakausar Shaikh Ramjan Pinjari