公开(公告)号：US11061460B2

公开(公告)日：2021-07-13

申请号：US16457354

申请日：2019-06-28

申请人： Intel Corporation

发明人： Fuat Keceli ,  Tozer J. Bandorawalla ,  Grant McFarland ,  Jonathan M. Eastep ,  Federico Ardanaz

IPC分类号： G06F1/3203 ,  G06F1/3206 ,  G06F1/3234 ,  G06F1/3296

摘要： Embodiments of the present disclosure describe methods, apparatuses, storage media, and systems for Thermal Design Power (TDP) rebalancing among thermally-coupled processors and non-thermally-coupled processors, providing computing efficiency or homogeneity with respect to, including but not limited to, thermal requirements, power consumption, and processor operations. The TDP rebalancing may include implementing management circuitry and configuration control circuitry. Other embodiments may be described and claimed.