公开(公告)号：US20230164912A1

公开(公告)日：2023-05-25

申请号：US18094995

申请日：2023-01-10

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/02

CPC classification number: H05K1/0269 ,  H05K3/46 ,  H05K3/022

Abstract: A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.

公开(公告)号：US20220167495A1

公开(公告)日：2022-05-26

申请号：US17313006

申请日：2021-05-06

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU

IPC: H05K1/02 ,  H05K3/02 ,  H05K3/46

Abstract: A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer including a first dielectric layer, a conductive layer, and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test mark, the test mark includes a plurality of conductive patterns formed of the conductive layer, and the conductive patterns are arranged in a ring shape.

公开(公告)号：US20220157703A1

公开(公告)日：2022-05-19

申请号：US17572657

申请日：2022-01-11

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU

IPC: H01L23/498 ,  H01L21/48

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes a redistribution layer which includes a first dielectric layer, a conductive layer and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test pattern that includes a first conductive pattern, and the first conductive pattern is formed of the conductive layer.

公开(公告)号：US20230095239A1

公开(公告)日：2023-03-30

申请号：US18074525

申请日：2022-12-05

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Yeong-E CHEN ,  Cheng-En CHENG

IPC: H01L21/768 ,  H01L21/683 ,  H01L21/288 ,  H01L21/027 ,  H01L21/48 ,  H01L21/66

Abstract: The present disclosure discloses a method for manufacturing an electronic device, including: setting a basic working area; a photoresist coating process; a development process; an etching process; an exposure process; a metal plating process; and a polishing process, wherein the photoresist coating process, the development process, the etching process, the exposure process, the metal plating process and the polishing process respectively have a maximum optimized process area, and a smallest one of the maximum optimized process areas is selected as the basic working area.

公开(公告)号：US20220165628A1

公开(公告)日：2022-05-26

申请号：US17315389

申请日：2021-05-10

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Kuang-Chiang HUANG ,  Yu-Ting LIU ,  Yi-Hung LIN ,  Cheng-En CHENG

IPC: H01L21/66 ,  H01L23/00 ,  H01L21/48

Abstract: The present disclosure provides a manufacturing method of a package device, which includes providing a carrier substrate, a first conductive layer, and a release layer, where the carrier substrate has a device region and a peripheral region, and the first conductive layer and the release layer are disposed on the carrier substrate. The method further includes forming a second conductive layer on the release layer in the device region, where at least one of the first and second conductive layers includes a first pad in the peripheral region. The second conductive layer includes a second pad electrically connected to the first pad through the first conductive layer. The method also includes performing an inspection step to provide an input signal to one of the first and second pads, and to receive an output signal from another of the first and second pads.

公开(公告)号：US20220148972A1

公开(公告)日：2022-05-12

申请号：US17114507

申请日：2020-12-08

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU

IPC: H01L23/538 ,  H01L21/66 ,  H01L21/768

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes a redistribution layer which includes a first dielectric layer, a conductive layer and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test pattern that includes a first conductive pattern, and the first conductive pattern is formed of the conductive layer.

公开(公告)号：US20240023235A1

公开(公告)日：2024-01-18

申请号：US18373284

申请日：2023-09-27

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/02

CPC classification number: H05K1/0269 ,  H05K3/46 ,  H05K3/022

Abstract: The present disclosure provides a package device including a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.

公开(公告)号：US20230077312A1

公开(公告)日：2023-03-09

申请号：US17507915

申请日：2021-10-22

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU ,  Cheng-Chi WANG

IPC: H01L21/48 ,  H01L21/66 ,  H01L23/544

Abstract: The application relates to a method for manufacturing an electronic device, and in particular, to a method for manufacturing an electronic device with a carrier substrate. The method includes: providing a carrier; forming a first base layer on the carrier; and forming working units on the first base layer. The working units are spaced apart from one another.

公开(公告)号：US20220319995A1

公开(公告)日：2022-10-06

申请号：US17845991

申请日：2022-06-21

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU

IPC: H01L23/538 ,  H01L21/768 ,  H01L21/66

Abstract: A package device is provided and includes a redistribution layer. The redistribution layer includes a first dielectric layer, a second dielectric layer, and a conductive layer. The second dielectric layer is disposed on the first dielectric layer, and the second dielectric layer includes a dielectric pattern. The conductive layer is disposed between the first dielectric layer and the second dielectric layer, and the conductive layer includes a first conductive pattern. The dielectric pattern has a through hole, and in a top view of the package device, the first conductive pattern and the through hole are overlapped with each other.

公开(公告)号：US20250046623A1

公开(公告)日：2025-02-06

申请号：US18919664

申请日：2024-10-18

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU ,  Cheng-Chi WANG

IPC: H01L21/48 ,  H01L21/66 ,  H01L21/683 ,  H01L23/544

Abstract: The application relates to a method for manufacturing an electronic device, and in particular, to a method for manufacturing an electronic device with a carrier substrate. The method includes: providing a carrier substrate; forming a first base layer on the carrier substrate; forming a working unit on the first base layer, performing a detection step on the working unit to identify whether a defect is present, wherein the detection step includes automated optical inspection (AOI), electrical detection, or a combination thereof; and repairing the electronic device.