公开(公告)号：US11600547B2

公开(公告)日：2023-03-07

申请号：US16700361

申请日：2019-12-02

申请人： Infineon Technologies Austria AG

发明人： Jo Ean Joanna Chye ,  Teck Sim Lee ,  Ke Yan Tean ,  Wei-Shan Wang

IPC分类号： H01L23/367 ,  H01L23/40 ,  H01L23/498 ,  H01L23/528 ,  H01L23/42 ,  H01L23/495

摘要： A semiconductor package includes a die pad having a die attach surface, a first laterally separated and vertically offset from the die pad, a semiconductor die mounted on the die attach surface and comprising a first terminal on an upper surface of the semiconductor die, an interconnect clip that is electrically connected to the first terminal and to the first lead, and a heat spreader mounted on top of the interconnect clip. The interconnect clip includes a first planar section that interfaces with the upper surface of the semiconductor die and extends past an outer edge side of the die pad. The heat spreader covers an area of the first planar section that is larger than an area of the semiconductor die. The heat spreader laterally extends past a first outer edge side of the die pad that faces the first lead.

公开(公告)号：US20210175157A1

公开(公告)日：2021-06-10

申请号：US17108079

申请日：2020-12-01

申请人： Infineon Technologies Austria AG

发明人： Ralf Otremba ,  Chii Shang Hong ,  Jo Ean Joanna Chye ,  Teck Sim Lee ,  Hui Kin Lit ,  Ke Yan Tean ,  Lee Shuang Wang ,  Wei-Shan Wang

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L23/00

摘要： A semiconductor device includes a carrier, a first external contact, a second external contact, and a semiconductor die. The semiconductor die has a first main face, a second main face opposite to the first main face, a first contact pad disposed on the first main face, a second contact pad disposed on the second main face, a third contact pad disposed on the second main face, and a vertical transistor. The semiconductor die is disposed with the first main face on the carrier. A clip connects the second contact pad to the second external contact. A first bond wire is connected between the third contact pad and the first external contact. The first bond wire is disposed at least partially under the clip.

公开(公告)号：US20210166988A1

公开(公告)日：2021-06-03

申请号：US16700361

申请日：2019-12-02

申请人： Infineon Technologies Austria AG

发明人： Jo Ean Joanna Chye ,  Teck Sim Lee ,  Ke Yan Tean ,  Wei-Shan Wang

IPC分类号： H01L23/367 ,  H01L23/40 ,  H01L23/528 ,  H01L23/498

摘要： A semiconductor package includes a die pad having a die attach surface, a first laterally separated and vertically offset from the die pad, a semiconductor die mounted on the die attach surface and comprising a first terminal on an upper surface of the semiconductor die, an interconnect clip that is electrically connected to the first terminal and to the first lead, and a heat spreader mounted on top of the interconnect clip. The interconnect clip includes a first planar section that interfaces with the upper surface of the semiconductor die and extends past an outer edge side of the die pad. The heat spreader covers an area of the first planar section that is larger than an area of the semiconductor die. The heat spreader laterally extends past a first outer edge side of the die pad that faces the first lead.

公开(公告)号：US11804424B2

公开(公告)日：2023-10-31

申请号：US17108079

申请日：2020-12-01

申请人： Infineon Technologies Austria AG

发明人： Ralf Otremba ,  Chii Shang Hong ,  Jo Ean Joanna Chye ,  Teck Sim Lee ,  Hui Kin Lit ,  Ke Yan Tean ,  Lee Shuang Wang ,  Wei-Shan Wang

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/49562 ,  H01L23/3107 ,  H01L23/4952 ,  H01L24/83 ,  H01L2224/8381 ,  H01L2224/8382

摘要： A semiconductor device includes a carrier, a first external contact, a second external contact, and a semiconductor die. The semiconductor die has a first main face, a second main face opposite to the first main face, a first contact pad disposed on the first main face, a second contact pad disposed on the second main face, a third contact pad disposed on the second main face, and a vertical transistor. The semiconductor die is disposed with the first main face on the carrier. A clip connects the second contact pad to the second external contact. A first bond wire is connected between the third contact pad and the first external contact. The first bond wire is disposed at least partially under the clip.