公开(公告)号：US20160099207A1

公开(公告)日：2016-04-07

申请号：US14876624

申请日：2015-10-06

申请人： Infineon Technologies Austria AG

发明人： Edward Fuergut ,  Martin Gruber ,  Juergen Hoegerl

IPC分类号： H01L23/498 ,  H01L21/56 ,  H01L21/48

摘要： An electronic module includes a first insulation layer, at least one carrier having a first main surface, a second main surface situated opposite the first main surface, and side surfaces connecting the first and second main surfaces to one another, at least one semiconductor chip arranged on the second main surface of the carrier, wherein the semiconductor chip has contact elements, and a second insulation layer, which is arranged on the carrier and the semiconductor chip.

摘要翻译： 电子模块包括第一绝缘层，至少一个载体，具有第一主表面，与第一主表面相对的第二主表面以及将第一和第二主表面彼此连接的侧表面，至少一个半导体芯片布置 在载体的第二主表面上，其中半导体芯片具有接触元件，以及布置在载体和半导体芯片上的第二绝缘层。

公开(公告)号：US20150145111A1

公开(公告)日：2015-05-28

申请号：US14087070

申请日：2013-11-22

申请人： Infineon Technologies Austria AG

发明人： Manfred MENGEL ,  Edward Fuergut ,  Ralf Otremba ,  Juergen Hoegerl

IPC分类号： H01L25/16 ,  H01L25/00 ,  H01L23/528 ,  H01L23/31 ,  H01L23/495 ,  H01L21/56 ,  H01L25/07

CPC分类号： H01L25/165 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49531 ,  H01L23/49562 ,  H01L23/49575 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/0603 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2924/13055 ,  H01L2924/00

摘要： An electronic component which comprises an electrically conductive mounting structure, an electronic chip on the mounting structure, an electrically conductive redistribution structure on the electronic chip, and a periphery connection structure electrically coupled to the redistribution structure and being configured for connecting the electronic component to an electronic periphery, wherein at least one of the electrically conductive mounting structure and the electrically conductive redistribution structure comprises electrically conductive inserts in an electrically insulating matrix.

摘要翻译： 一种电子部件，包括导电安装结构，安装结构上的电子芯片，电子芯片上的导电再分布结构，以及电耦合到再分配结构并被配置为将电子部件连接到电子部件的外围连接结构 电子周边，其中所述导电安装结构和所述导电再分配结构中的至少一个包括电绝缘矩阵中的导电插入件。

公开(公告)号：US10418313B2

公开(公告)日：2019-09-17

申请号：US14876624

申请日：2015-10-06

申请人： Infineon Technologies Austria AG

发明人： Edward Fuergut ,  Martin Gruber ,  Juergen Hoegerl

IPC分类号： H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L23/433

摘要： An electronic module includes a first insulation layer, at least one carrier having a first main surface, a second main surface situated opposite the first main surface, and side surfaces connecting the first and second main surfaces to one another, at least one semiconductor chip arranged on the second main surface of the carrier, wherein the semiconductor chip has contact elements, and a second insulation layer, which is arranged on the carrier and the semiconductor chip.