公开(公告)号：US20220091160A1

公开(公告)日：2022-03-24

申请号：US16948489

申请日：2020-09-21

Applicant: Infineon Technologies AG

Inventor： Gerald WRIESNEGGER ,  Leo AICHRIEDLER ,  Tomas Manuel REITER ,  Christoph KOCH ,  Andreas SCHENK ,  Johannes HACKL ,  Volker Thorsten SCHMIDT

IPC: G01R15/20 ,  G01R19/25 ,  G01R33/06 ,  H02P27/06

Abstract: A method may include pressing a sensor module onto a control board such that the sensor module is at an initial position where an air gap is present between a module body of the sensor module and the control board such that compliant pins of the sensor module are partially inserted into the control board. The method may include mounting the control board on a power module to cause pins of the power module to be at least partially inserted into the control board and the sensor module to be at least partially inserted in the power module such that a protrusion is through an opening in a busbar. The method may include pressing the control board onto the power module to cause the pins of the power module to be further inserted into the control board, the sensor module to be further inserted in the power module, and the sensor module to be at a final position.