公开(公告)号：US09435849B2

公开(公告)日：2016-09-06

申请号：US14319268

申请日：2014-06-30

Applicant: Infineon Technologies AG

Inventor： Erwin Thalmann ,  Michael Leutschacher ,  Christian Musshoff ,  Stefan Kramp

IPC: G01R31/26 ,  G01R1/073

CPC classification number: G01R31/2608 ,  G01R1/07342 ,  G01R31/2601 ,  G01R31/2621 ,  G01R31/2637 ,  G01R31/2644

Abstract: A method includes: providing a test apparatus; providing an electrically conductive carrier; providing a semiconductor substrate having a first main face, a second main face opposite to the first main face, and a plurality of semiconductor dies, the semiconductor dies including a first contact element on the first main face and a second contact element on the second main face; placing the semiconductor substrate on the carrier with the second main face facing the carrier; electrically connecting the carrier to a contact location disposed on the first main face; and testing a semiconductor die by electrically connecting the test apparatus with the first contact element of the semiconductor die and the contact location.

Abstract translation: 一种方法包括：提供测试装置; 提供导电载体; 提供具有第一主面，与第一主面相反的第二主面的半导体衬底和多个半导体管芯，所述半导体管芯包括在第一主面上的第一接触元件和第二主体上的第二接触元件 面对; 将所述半导体衬底放置在所述载体上，其中所述第二主面朝向所述载体; 将所述载体电连接到设置在所述第一主面上的接触位置; 以及通过将测试装置与半导体管芯的第一接触元件和接触位置电连接来测试半导体管芯。

公开(公告)号：US10018667B2

公开(公告)日：2018-07-10

申请号：US15239269

申请日：2016-08-17

Applicant: Infineon Technologies AG

Inventor： Erwin Thalmann ,  Michael Leutschacher ,  Christian Musshoff ,  Stefan Kramp

IPC: G01R31/26 ,  G01R1/073

CPC classification number: G01R31/2608 ,  G01R1/07342 ,  G01R31/2601 ,  G01R31/2621 ,  G01R31/2637 ,  G01R31/2644

Abstract: A method for testing semiconductor dies includes: providing a test apparatus; providing an electrically conductive carrier; providing a semiconductor substrate having a first main face, a second main face opposite to the first main face, and a plurality of semiconductor dies, the semiconductor dies including a first contact element on the first main face and a second contact element on the second main face; placing the semiconductor substrate on the carrier with the second main face facing the carrier; electrically connecting the carrier to a contact location disposed on the first main face; and testing a first semiconductor die of the plurality of semiconductor dies by electrically connecting the test apparatus with the first contact element of the first semiconductor die and the contact location.

公开(公告)号：US20160356839A1

公开(公告)日：2016-12-08

申请号：US15239269

申请日：2016-08-17

Applicant: Infineon Technologies AG

Inventor： Erwin Thalmann ,  Michael Leutschacher ,  Christian Musshoff ,  Stefan Kramp

IPC: G01R31/26

CPC classification number: G01R31/2608 ,  G01R1/07342 ,  G01R31/2601 ,  G01R31/2621 ,  G01R31/2637 ,  G01R31/2644

Abstract: A method for testing semiconductor dies includes: providing a test apparatus; providing an electrically conductive carrier; providing a semiconductor substrate having a first main face, a second main face opposite to the first main face, and a plurality of semiconductor dies, the semiconductor dies including a first contact element on the first main face and a second contact element on the second main face; placing the semiconductor substrate on the carrier with the second main face facing the carrier; electrically connecting the carrier to a contact location disposed on the first main face; and testing a first semiconductor die of the plurality of semiconductor dies by electrically connecting the test apparatus with the first contact element of the first semiconductor die and the contact location.

Abstract translation: 一种用于测试半导体管芯的方法，包括：提供测试装置; 提供导电载体; 提供具有第一主面，与第一主面相反的第二主面的半导体衬底和多个半导体管芯，所述半导体管芯包括在第一主面上的第一接触元件和第二主体上的第二接触元件 面对; 将所述半导体衬底放置在所述载体上，其中所述第二主面朝向所述载体; 将所述载体电连接到设置在所述第一主面上的接触位置; 以及通过将测试装置与第一半导体管芯的第一接触元件和接触位置电连接来测试多个半导体管芯的第一半导体管芯。

公开(公告)号：US20150377954A1

公开(公告)日：2015-12-31

申请号：US14319268

申请日：2014-06-30

Applicant: Infineon Technologies AG

Inventor： Erwin Thalmann ,  Michael Leutschacher ,  Christian Musshoff ,  Stefan Kramp

IPC: G01R31/26 ,  G01R1/073

CPC classification number: G01R31/2608 ,  G01R1/07342 ,  G01R31/2601 ,  G01R31/2621 ,  G01R31/2637 ,  G01R31/2644

Abstract: A method includes: providing a test apparatus; providing an electrically conductive carrier; providing a semiconductor substrate having a first main face, a second main face opposite to the first main face, and a plurality of semiconductor dies, the semiconductor dies including a first contact element on the first main face and a second contact element on the second main face; placing the semiconductor substrate on the carrier with the second main face facing the carrier; electrically connecting the carrier to a contact location disposed on the first main face; and testing a semiconductor die by electrically connecting the test apparatus with the first contact element of the semiconductor die and the contact location.

Abstract translation: 一种方法包括：提供测试装置; 提供导电载体; 提供具有第一主面，与第一主面相对的第二主面的半导体衬底和多个半导体管芯，所述半导体管芯包括在第一主面上的第一接触元件和第二主体上的第二接触元件 面对; 将所述半导体衬底放置在所述载体上，其中所述第二主面朝向所述载体; 将所述载体电连接到设置在所述第一主面上的接触位置; 以及通过将测试装置与半导体管芯的第一接触元件和接触位置电连接来测试半导体管芯。